Structural and Electrical Characterizations of CuNi Thin Film Resistors

被引：6

作者：

Yusop, Nurul Khalidah ^{[1
]}

Shariff, Nurulakmal Mohd ^{[1
]}

Chow, See Chin

Ismail, Ahmad Badri ^{[1
]}

机构：

[1] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Engn Campus, Nibong Tebal 14300, Pulau Pinang, Malaysia

来源：

5TH INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN MATERIALS, MINERALS AND ENVIRONMENT (RAMM) & 2ND INTERNATIONAL POSTGRADUATE CONFERENCE ON MATERIALS, MINERAL AND POLYMER (MAMIP) | 2016年 / 19卷

关键词：

CuNi thin film; four-point probes test; thin film resistor; RESISTIVITY; RESISTANCE; THICKNESS;

D O I：

10.1016/j.proche.2016.03.061

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

This work studied the development of Cu-Ni for thin film resistor; specifically reported in this paper is the surface morphology and resistance. Films were deposited on the substrate of commercialized flame retardant (generally known as FR4) printed circuit board by using thermal evaporator. The thickness of the film was set to 100 nm and the dc current was maintained at 26 A. The sheet resistance and bulk resistivity of the thin films were measured via four-point probe test. The stability of thin film resistor was measured through temperature coefficient of resistance (TCR). According to the experimental results, it can be seen that the sheet resistance of the thin film resistor decreased with increasing copper composition. (C) 2016 The Authors. Published by Elsevier B.V.

引用

页码：619 / 625

页数：7

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