Vertical assembly of carbon nanotubes for via interconnects

被引：7

作者：

Wei Qin-Qin ^{[1
,2
]}

Wei Zi-Jun ^{[1
]}

Ren Li-Ming ^{[1
]}

Zhao Hua-Bo ^{[1
]}

Ye Tian-Yang ^{[1
]}

Shi Zu-Jin ^{[3
]}

Fu Yun-Yi ^{[1
]}

Zhang Xing ^{[1
]}

Huang Ru ^{[1
]}

机构：

[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China

[2] Shandong Univ Technol, Sch Elect & Elect Engn, Zibo 255049, Peoples R China

[3] Peking Univ, Coll Chem & Mol Engn, Beijing 100871, Peoples R China

来源：

CHINESE PHYSICS B | 2012年 / 21卷 / 08期

基金：

中国国家自然科学基金;

关键词：

carbon nanotube; via interconnects; dielectrophoresis; electrical properties; contact resistance; RELIABILITY; RESISTANCE; CONTACT;

D O I：

10.1088/1674-1056/21/8/088103

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

The via interconnects are key components in ultra-large scale integrated circuits (ULSI). This paper deals with a new method to create single-walled carbon nanotubes (SWNTs) via interconnects using alternating dielectrophoresis (DEP). Carbon nanotubes are vertically assembled in the microscale via-holes successfully at room temperature under ambient condition. The electrical evaluation of the SWNT vias reveals that our DEP assembly technique is highly reliable and the success rate of assembly can be as high as 90%. We also propose and test possible approaches to reducing the contact resistance between CNT vias and metal electrodes.

引用

页数：8

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