Chip-scale Optical Interconnects Based on Hybrid Integrated Multiple Quantum Well Devices

被引:0
|
作者
Gu, Tian [1 ]
Nair, Rohit [1 ]
Haney, Michael W. [1 ]
机构
[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA
关键词
Optical Interconnects; Photonic Integrated Circuits;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hybrid integrated chip-scale optical interconnects based on small-footprint coupling to surface-normal MQW devices are advanced. Refinements to the grayscale lithographic fabrication process provide a path to ultra-high-density seamless interfacing between the on-and off-chip domains.
引用
收藏
页码:276 / 277
页数:2
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