LOW TEMPERATURE ADHESIVE WAFER BONDING USING OSTE(+) FOR HETEROGENEOUS 3D MEMS INTEGRATION

被引：0

作者：

Forsberg, Fredrik ^{[1
]}

Saharil, Farizah ^{[1
]}

Stemme, Goran ^{[1
]}

Roxhed, Niclas ^{[1
]}

van der Wijngaart, Wouter ^{[1
]}

Haraldsson, Tommy ^{[1
]}

Niklaus, Frank ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Microsyst Technol Lab, Sch Elect Engn, Stockholm, Sweden

来源：

26TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2013) | 2013年

基金：

欧洲研究理事会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.

引用

页码：343 / 346

页数：4

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