Investigation on surface integrity of Co-Cr L605 alloy in photochemical machining

被引:9
|
作者
Thorat, Shrikant [1 ]
Sadaiah, Mudigonda [1 ]
机构
[1] Dr Babasaheb Ambedkar Technol Univ, Raigad 402103, Maharashtra, India
关键词
Co-Cr L605; Photochemical machining; Manufacturing processes; Etch rate; Surface roughness; RESIDUAL-STRESSES; MO ALLOY; MICRO;
D O I
10.1016/j.jmapro.2019.01.006
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This investigation is focused on the surface integrity of Co-Cr L605 using photochemical machining (PCM). The study focuses mainly on the effects of different manufacturing processes, such as forging, wire-EDM, and rolling, on the metallurgical parameters of Co-Cr L605 in PCM. Results were obtained for residual stresses, grain size, local grain misorientation, and interplanar distances. Effects on the etch rate and surface roughness were studied, and found to be maximum for forging, while they were lower for rolling. An overall study was conducted to correlate PCM process parameters with bio-functional aspects of the Co-Cr L605 alloy.
引用
收藏
页码:483 / 493
页数:11
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