A field study on root cause analysis of defects in space software

被引:8
|
作者
Silva, Nuno [1 ,2 ]
Cunha, Joao Carlos [1 ,3 ]
Vieira, Marco [1 ]
机构
[1] Univ Coimbra, DEI CISUC, Polo 2, P-3030290 Coimbra, Portugal
[2] CRIT Software SA, Parque Ind Taveiro,Lote 49, P-3045504 Coimbra, Portugal
[3] Inst Politecn Coimbra ISEC, DEIS, P-3030199 Coimbra, Portugal
关键词
ODC; Critical systems; Defect; Classification; Root cause analysis; Dependability; ANOMALIES;
D O I
10.1016/j.ress.2016.08.016
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Critical systems, such as space systems, are developed under strict requirements envisaging high integrity in accordance to specific standards. For such software systems, an independent assessment is put into effect (Independent Software Verification and Validation - ISVV) after the regular development lifecycle and V&V activities, aiming at finding residual faults and raising confidence in the software. However, it has been observed that there is still a significant number of defects remaining at this stage, questioning the effectiveness of the previous engineering processes. This paper presents a root cause analysis of 1070 defects found in four space software projects during ISVV, by applying an improved Orthogonal Defect Classification (ODC) taxonomy and examining the defect types, triggers and impacts, in order to identify why they reached such a later stage in the development. The paper also puts forward proposals for modifications to both the software development (to prevent defects) and the V&V activities (to better detect defects) and an assessment methodology for future works on root cause analysis. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:213 / 229
页数:17
相关论文
共 50 条
  • [1] Detection and Root Cause Analysis of Memory-Related Software Aging Defects by Automated Tests
    Langner, Felix
    Andrzejak, Artur
    2013 IEEE 21ST INTERNATIONAL SYMPOSIUM ON MODELING, ANALYSIS & SIMULATION OF COMPUTER AND TELECOMMUNICATION SYSTEMS (MASCOTS 2013), 2013, : 365 - 369
  • [2] Patient safety - Incorporating drawing software into root cause analysis software
    Williams, L
    Grayson, D
    Gosbee, G
    JOURNAL OF THE AMERICAN MEDICAL INFORMATICS ASSOCIATION, 2002, 9 (06) : S52 - S53
  • [3] Patient safety - Incorporating drawing software into Root Cause Analysis software
    Williams, L
    Grayson, D
    Gosbee, J
    JOURNAL OF THE AMERICAN MEDICAL INFORMATICS ASSOCIATION, 2001, : 1059 - 1059
  • [4] A Survey of Automated Root Cause Analysis of Software Vulnerability
    Jurn, JeeSoo
    Kim, Taeeun
    Kim, Hwankuk
    INNOVATIVE MOBILE AND INTERNET SERVICES IN UBIQUITOUS COMPUTING, IMIS-2018, 2019, 773 : 756 - 761
  • [5] An Approach to Cognitive Root Cause Analysis of Software Vulnerabilities
    Hytopoulos, Theo
    Chan, Marvin
    Roth, Keegan
    Wasson, Rylan
    Huang, Fuqun
    PRODUCT-FOCUSED SOFTWARE PROCESS IMPROVEMENT, PROFES 2024, 2025, 15452 : 11 - 26
  • [6] Root Cause Analysis of Surgical Pathology Identification and Information Defects
    Raab, S. S.
    King, A. M.
    Grzybicki, D. M.
    LABORATORY INVESTIGATION, 2009, 89 : 366A - 366A
  • [7] Root Cause Analysis of Surgical Pathology Identification and Information Defects
    Raab, S. S.
    King, A. M.
    Grzybicki, D. M.
    MODERN PATHOLOGY, 2009, 22 : 366A - 366A
  • [8] Micro-bridge defects: Characterization and root cause analysis
    Applied Materials Belgium, B-3001 Leuven, Belgium
    不详
    不详
    不详
    不详
    Proc SPIE Int Soc Opt Eng,
  • [9] Micro-bridge defects: characterization and root cause analysis
    Santoro, Gaetano
    Van den Heuvel, Dieter
    Braggin, Jennifer
    Rosslee, Craig
    Leray, Philippe
    Cheng, Shaunee
    Jehoul, Christiane
    Schreutelkamp, Robert
    Hillel, Noam
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXIV, 2010, 7638
  • [10] Systematic root cause analysis of metal defects in FINFET devices
    Lua, Winson
    Lim, Soon-Huat
    Ravikumar, Venkat Krishnan
    Phoa, Angeline
    2017 IEEE 24TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2017,