Indentation creep behavior of thermally aged Sn-5wt%Sb-1.5wt%Ag solder integrated with ZnO nanoparticles

被引：6

作者：

Mansour, M. M. ^{[1
]}

Saad, G. ^{[1
]}

Wahab, L. A. ^{[2
]}

Fawzy, A. ^{[1
]}

机构：

[1] Ain Shams Univ, Dept Phys, Fac Educ, Cairo, Egypt

[2] Natl Ctr Radiat Res & Technol, Dept Phys, Cairo, Egypt

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2019年 / 30卷 / 09期

关键词：

IMPRESSION CREEP; MECHANICAL-PROPERTIES; LEAD; MICROSTRUCTURE; ADDITIONS; HARDNESS; ALLOYS; TIN;

D O I：

10.1007/s10854-019-01152-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In the present study the microstructure changes and their impacts on creep parameters from the indentation creep testing are investigated. For this propose the alloys Sn-5Sb-1.5Ag (SSA) plain solder and SSA reinforced with ZnO nanoparticles composite solder have been fabricated. The specimens were isothermally aged at 125, 175 degrees C for 24h, and then quenched in air at 27 degrees C. The microstructure of the present solders is identified by X-ray diffraction (XRD). A crystalline -Sn and intermetallic compounds (IMCs) SnSb and Ag3Sn are detected. Microstructural evolutions revealed refinement of SnSb and Ag3Sn IMCs as a result of ZnO addition. The reinforcing ZnO nanoparticeles are found to decrease the creep strain. The calculated values of the stress exponent n for the indentation creep process are found to decrease with increasing aging temperature. The value of n of the composite solder was found less than that of the plain solder at the same testing conditions.

引用

页码：8348 / 8357

页数：10

共 17 条

[1] Indentation creep behavior of thermally aged Sn-5wt%Sb-1.5wt%Ag solder integrated with ZnO nanoparticles
M. M. Mansour
G. Saad
L. A. Wahab
A. Fawzy
Journal of Materials Science: Materials in Electronics, 2019, 30 : 8348 - 8357
[2] Tensile characteristics of Sn-5wt%Sb-1.5wt%Ag reinforced by nano-sized ZnO particles
Mansour, M. M.
Fawzy, A.
Wahab, L. A.
Saad, G.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (05) : 4831 - 4841
[3] Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions
Geranmayeh, A. R.
Mahmudi, R.
Khalatbari, F.
Kashi, N.
Nayyeri, G.
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (03) : 717 - 723
[4] Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions
A.R. Geranmayeh
R. Mahmudi
F. Khalatbari
N. Kashi
G. Nayyeri
Journal of Electronic Materials, 2014, 43 : 717 - 723
[5] Tensile characteristics of Sn–5wt%Sb–1.5wt%Ag reinforced by nano-sized ZnO particles
M. M. Mansour
A. Fawzy
L. A. Wahab
G. Saad
Journal of Materials Science: Materials in Electronics, 2019, 30 : 4831 - 4841
[6] Effect of ageing time on the tensile behavior of Sn-3.5 wt% Ag-0.5 wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles
Sobhy, M.
El-Refai, A. M.
Mousa, M. M.
Saad, G.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2015, 646 : 82 - 89
[7] Investigation of Indentation Creep Behavior of Sn-3.5Ag-2Bi-1.5In Lead-Free Solder
Chen Zhengzhou
Zeng Ming
Shen Baoluo
Liao Chunli
RARE METAL MATERIALS AND ENGINEERING, 2009, 38 : 86 - 90
[8] Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) lead free solder alloy
Eid, E. A.
Fouda, A. N.
Duraia, El-Shazly M.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 657 : 104 - 114
[9] Effects of torsional oscillation on tensile behavior of Sn-3.5 wt% Ag alloy with and without adding ZnO nanoparticles
Sobhy, M.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 610 : 237 - 242
[10] Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress–strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy
M. Sobhy
A. M. El-Refai
A. Fawzy
Journal of Materials Science: Materials in Electronics, 2016, 27 : 2349 - 2359

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