Advanced Packaging Stepper for 300mm Wafer Process

被引：0

作者：

Zhou Chang ^{[1
]}

Li Zhongyu ^{[1
]}

Zhang Lei ^{[1
]}

机构：

[1] Shanghai Micro Elect Equipment CO LTD, Shanghai, Peoples R China

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

With development of advanced package technology, requirements for lithographic process become tighter than before. When dealing with 200mm or 300mm wafer, stepper shows better uniformity of CD and overlay. SSB500 stepper can be used in RDL and Bump process. This paper introduces features of SSB500 stepper, such as wide band exposure light source, large field size, flexible alignment strategy, direct focus measurement, and proposes absolute overlay error concept and measurement method based on golden wafer. It also provides test data for CDU, UDoF, overlay for single machine and matching, thick photo resist performance, which shows specification of the stepper meeting well with advanced package process.

引用

页码：935 / 938

页数：4

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