Microstructure and microtexture in pure copper processed by high-pressure torsion

The evolution of microstructure and microtexture in high purity copper was examined after processing by high-pressure torsion (HPT). Copper disks were annealed for 1 h at 800 A degrees C and later processed monotonously in HPT at ambient temperature for 1/4, 1/2, 1, and 5 turns under a pressure of 6.0 GPa. Electron backscattered diffraction (EBSD) measurements were taken for each disk at three positions: center, mid-radius, and near-edge. Results from EBSD for samples processed between 1/4 and 1 turn indicate the formation of I 3 pound twin boundaries by recrystallization before complete microstructural refinement. The results show a gradual increase in the homogeneity of the microstructure with increasing numbers of turns, reaching a stabilized ultrafine-grained structure at 5 turns with a bimodal distribution of fine and coarse grains of 0.15 and 0.5 mu m in diameter, respectively. The occurrence of recrystallization in the early straining stages was further supported by examining microtexture development with increasing numbers of turns, where this shows a gradual transition from a shear texture to a mixture of shear and recrystallization and later to a shear texture at high HPT strains. The promotion of recrystallization during HPT is probably related to the high purity of the copper.