Growth Behavior of Whiskers in Sn-Based Lead-Free Solders

被引：0
|
作者：
Liu Sihan [1 ]
Ma Limin [1 ]
Shu Yutian [1 ]
Zuo Yong [1 ]
Guo Fu [1 ]
机构：
[1] Beijing Univ Technol, Beijing 100124, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2015年 / 44卷 / 11期
关键词：
whisker; lead-free solders; POSS; TIN WHISKERS; FINISHES; JOINTS;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The effects of organic-inorganic cage-type polyhedral oligomeric silsesquioxane (POSS) on the whisker formation behavior of Sn-based lead-free solders were investigated. Pure Sn and Sn3.0Ag0.5Cu (SAC305) solders were used as solder matrix, and the composite solder was fabricated with 3 wt% POSS trisilanol addition. The samples were tested under thermal cycling to accelerate whisker growth, and the temperature range varied between -40 degrees C and 85 degrees C. The surficial evolution and interfacial microstructure were observed. The results indicate that POSS would stabilize solder matrix under thermal cycling condition. Meanwhile, the strength and microhardness of solders are improved by POSS significantly, which consequently reduce the deformations in the solders caused by deformations, and inhibit whisker formation eventually.
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收藏
页码：2868 / 2872
页数：5
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