Introduction to the Special Issue on the 2007 International Integrated Reliability Workshop

被引：0
|
作者：
Lenahan, Patrick M. [1 ]
Knowlton, Bill [2 ]
Conley, John F., Jr. [3 ]
Tonti, Bill [4 ]
Suehle, John [5 ]
Grasser, Tibor [6 ]
机构：
[1] Penn State Univ, University Pk, PA 16801 USA
[2] Boise State Univ, Boise, ID 83725 USA
[3] Oregon State Univ, Corvallis, OR 97331 USA
[4] IBM Microelect, Essex Jct, VT 05452 USA
[5] NIST, Gaithersburg, MD 20899 USA
[6] Vienna Univ Technol, A-1040 Vienna, Austria
来源：
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2008年 / 8卷 / 03期
关键词：
D O I：
10.1109/TDMR.2008.2006011
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
No abstract available
引用
收藏
页码：490 / 490
页数：1
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