Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance

被引：0
|
作者：
Wen, Haoran [1 ,2 ]
Ji, Yaqiang [1 ]
Zhang, Kai [2 ]
Yuen, Matthew M. F. [2 ]
Lee, S. W. Ricky [2 ]
Fu, Xian-Zhu [1 ]
Sun, Rong [1 ]
Wong, Ching-Ping [3 ]
机构：
[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen High Dens Elect Packaging & Device Assem, Guangdong Prov Key Lab Mat High Dens Elect Packag, Shenzhen 518055, Peoples R China
[2] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Hong Kong, Peoples R China
[3] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
来源：
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年
关键词：
thermal interface materials; phase change alloy; Cu filler composite; thermal resistance;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between AI blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
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页码：331 / 333
页数：3
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