Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions

被引:13
|
作者
Ceré, S [1 ]
Vázquez, M [1 ]
机构
[1] Univ Nacl Mar del Plata, Fac Ingn, INTEMA, Div Corros, Mar Del Plata, Buenos Aires, Argentina
关键词
D O I
10.1023/A:1015394909442
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The influence of Ni as an alloying element in the improvement of the corrosion resistance of copper-base alloys, using boric-borate buffer (pH=7.8) as electrolyte, was studied. Electrochemical and spectrophotometrical techniques were combined to account for the presence of cuprous oxide. When the nickel content increased and reached 30%, the composition of the film changed noticeably by the incorporation of Ni(II) compounds.
引用
收藏
页码:493 / 495
页数:3
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