A Nano-silver Inkjet Conductive Ink with Excellent Adhesion

被引：0
|
作者：
Ran Jun [1 ]
Mo Lixin [1 ]
Li Wenbo [1 ]
Li Weiwei [1 ]
Fan Xinming [1 ]
Fu Jilan [1 ]
Li Luhai [1 ]
机构：
[1] Beijing Inst Graph Commun, Beijing Key Lab Printing & Packaging Mat & Techno, Printable Elect Res Ctr, Beijing, Peoples R China
来源：
ADVANCES IN PRINTING AND PACKAGING TECHNOLOGIES | 2013年 / 262卷
关键词：
Nano-silver; Resistance; Conductive ink; Adhesion;
D O I：
10.4028/www.scienfic.net/AMM.262.501
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
In this paper, the preparation of a solvent based nano-silver inkjet conductive ink with excellent adhesion was investigated and applied. Nano-silver particles, with dodecylamine (DDA) as the protective agent, were prepared and the effect of protective agent on the post heat-treatment of nano-silver films was investigated. Results of electrical resistance, micro-structural evolution and thermal analysis showed that the Ag/DDA films require a relatively low treatment temperature to convert into conductive materials. Then the conductive ink was prepared with well dispersed Ag/DDA nanoparticles and the ink was printed patterns on PET, PI films through EPSON ME 33 inkjet printer, the patterns showed a sheet resistance is 182.3m Omega 52/square and the adhesion reached to 5B after heat-treating at 120 degrees C for 60min.
引用
收藏
页码：501 / 504
页数：4
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