Sn-Zn lead-free solder applied to notebook personal computer

被引：0
|
作者：
Suzuki, M [1 ]
Matsuoka, H [1 ]
Kono, E [1 ]
Igarashi, M [1 ]
机构：
[1] NEC Corp Ltd, Prod Technol Labs, Nakahara Ku, Kawasaki, Kanagawa 2118666, Japan
来源：
2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 2001年 / 4587卷
关键词：
lead-free solder; Sn-Zn system; solderjoint; joint strength; reflow soldering;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We investigated Sn-Zn lead-free solder as a substitute for the conventional Sn-Pb solder in the reflow soldering process and estimated the reliability of the solder joints in mass-produced notebook PCs, which were then shipped using Sn-Zn lead-free solder.
引用
收藏
页码：298 / 303
页数：2
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