Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films

被引:58
|
作者
Sun, H. L. [1 ]
Song, Z. X. [1 ]
Guo, D. G. [1 ]
Ma, F. [1 ]
Xu, K. W. [1 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Sch Mat Sci & Engn, Xian 710049, Peoples R China
基金
中国国家自然科学基金;
关键词
Tungsten film; Microstructure; Nanoindentation; Hardness; Modulus; PHASE-TRANSFORMATION; INDENTATION; HARDNESS; DEFORMATION; BEHAVIOR;
D O I
10.1016/S1005-0302(10)60014-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Tungsten (W) thin films were prepared by magnetron sputtering onto Si (100) substrates. Their microstructures were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from beta-W to alpha-W structure. In addition, remarkable hardness enhancement both for the deposited and annealed W films, were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.
引用
收藏
页码:87 / 92
页数:6
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