High Quality Integrated Inductor in Fan-Out Wafer-Level Packaging Technology for mm-Wave Applications

被引：0
|
作者：
Murugesan, Kavin Senthil [1 ]
Chernobryvko, Mykola [2 ]
Zinal, Sherko [2 ]
Rossi, Marco [2 ]
Ndip, Ivan [2 ]
Boettcher, Mathias [2 ]
Lang, Klaus Dieter [1 ]
Wieland, Marcel [3 ]
Goetze, Christian [3 ]
Bin Halim, Saquib [3 ]
Trewhella, Jean [3 ]
机构：
[1] Tech Univ Berlin, Berlin, Germany
[2] Fraunhofer IZM, Berlin, Germany
[3] GLOBALFOUNDRIES, Dresden, Germany
来源：
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2020年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
EuMC06-3
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页数：1
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