Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

被引：27
|
作者：
Tsukamoto, Hideaki [1 ]
Nishimura, Tetsuro [2 ]
Nogita, Kazuhiro [1 ]
机构：
[1] Univ Queensland, Sch Mat Engn, St Lucia, Qld 4072, Australia
[2] Nihon Super Co Ltd, Osaka 5640063, Japan
来源：
MATERIALS LETTERS | 2009年 / 63卷 / 30期
关键词：
Intermetallic compound (IMC); Crystal growth; Lead-free solder; X-ray diffraction (XRD); AG-CU;
D O I：
10.1016/j.matlet.2009.09.041
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study examines the epitaxial growth of the intermetallic compound (IMC) of Cu6Sn5 (or (Cu,Ni)(6)Sn-5) that forms at the interface between molten Sn-based lead-free solders and non-textured polycrystalline Cu substrates. Sn, Sn-Cu, Sn-Cu-Ni and Sn-Ag-Cu solders were investigated. The dominant growing planes in a hexagonal structure of this IMC on Cu substrates are (101) and (102). Addition of trace Ni into Sn-Cu solders leads to an increase in (101) growth and a decrease in (102) growth. The presence of Ag in Sn-Ag-Cu solders facilitates (102) growth and suppresses (101) growth. Such an epitaxial growth should have a large influence on the mechanical and electrical characteristics of the Sn-based solder/Cu joints. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：2687 / 2690
页数：4
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