Automated detection and quantification of hidden voids in triplex bonding layers using active lock-in thermography

被引：15
|
作者：
Song, Homin [1 ]
Lim, Hyung Jin [2 ]
Lee, Sangmin [2 ]
Sohn, Hoon [2 ]
Yun, Wonjun [3 ]
Song, Eunha [3 ]
机构：
[1] Univ Illinois, Dept Civil & Environm Engn, Urbana, IL 61801 USA
[2] Korea Adv Inst Sci & Technol, Dept Civil & Environm Engn, Daejeon 305701, South Korea
[3] Hyundai Heavy Ind Co LTD, Protect Coating Res Dept, Ulsan 682792, South Korea
来源：
NDT & E INTERNATIONAL | 2015年 / 74卷
基金：
新加坡国家研究基金会;
关键词：
Active lock-in thermography; Hidden void detection and quantification; Non-uniform thermal distribution compensation; Binary image processing; Empirical void size mapping; NONDESTRUCTIVE EVALUATION; MODULATED THERMOGRAPHY; INFRARED THERMOGRAPHY; DEFECT DETECTION;
D O I：
10.1016/j.ndteint.2015.05.004
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This paper presents an automated hidden void detection and quantification technique for inspecting triplex bonding layers in liquefied natural gas (LNG) carriers using active lock-in thermography. Hidden voids are first detected and visualized by an amplitude image and a series of binary image processing. Then, the sizes of the detected voids are quantified using an empirical mapping function, relating the detected void sizes to the void sizes obtained by an independent X-ray testing. The performance of the proposed technique is blind tested using two triplex specimens. The experimental results reveal that the hidden voids can be successfully detected and quantified. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：94 / 105
页数：12
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