A New Polishing Head In Magnetic-electrochemical Compound Polishing

被引：0
|
作者：
Niu, Yong Jiang [1 ]
Shi, Li Min [1 ]
Liu, Er Liang [2 ]
机构：
[1] Tianshui Normal Univ, Dept Mech & Elect Engn, Tianshui 741001, Gansu, Peoples R China
[2] Harbin Univ Sci & Technol, Dept Mech & Power Engn, Harbin 150080, Peoples R China
来源：
ADVANCED TEXTILE MATERIALS, PTS 1-3 | 2011年 / 332-334卷
关键词：
Polishing head; Magnetic field; Magnetic-electrochemical compound polishing;
D O I：
10.4028/www.scientific.net/AMR.332-334.2099
中图分类号：
TB3 [工程材料学]; TS1 [纺织工业、染整工业];
学科分类号：
0805 ; 080502 ; 0821 ;
摘要：
A new polishing head is studied in magnetic-electrochemical compound polishing in the paper. Added a magnetic field whose direction is parrallel to the electrical field's directions, the charged partcles between two electrodes can move in spirals in magnetic-electrochemical compound polishing, and then the condition of chemical reaction is improved. If the direction of magnetic field is changed alternative, the effect of polishing can be improved more clearly. The tool can be fixed on spindle of CNC easily. The tool is flexible, so it can make the polishing head and workpiece touch evenly each other. Because the head of magnetic-electrochemical compoud polishing tool is a series, the head can be replaced conveniently according to different surface. Particularly,the tool can change strength of the magnetic field easily. At last, the tool is tested and its function is perfect.
引用
收藏
页码：2099 / +
页数：2
相关论文
共 50 条
  • [1] Development of a New Magnetic-Electrochemical Compound Polishing Tool
    Shi, L. M.
    Yong, J. N.
    Liu, J.
    Liu, E. L.
    ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XVI, 2011, 487 : 298 - +
  • [2] The Effect of the Magnetic Field's Direction to Polishing in a Magnetic-electrochemical Compound Polishing
    Shi, Limin
    Niu, Yongjiang
    Liu, Erliang
    Ma, Yongfeng
    ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV, 2009, 416 : 1 - +
  • [3] The Function of Magnetic Field in a Magnetic-electrochemical Compound Polishing
    Shi, Li Min
    Liu, Er Liang
    Niu, Yong Jiang
    Chen, Yu Quan
    MANUFACTURING SCIENCE AND ENGINEERING, PTS 1-5, 2010, 97-101 : 4141 - +
  • [4] The analysis on movement of the charged particles in a magnetic-electrochemical compound polishing
    Shi, Limin
    Chen, Yuquan
    Liu, Erliang
    ADVANCES IN MACHINING AND MANUFACTURING TECHNOLOGY IX, 2008, 375-376 : 6 - +
  • [5] To Study the Effect of the Magnetic Field's Alternative Direction in the Magnetic-electrochemical Compound Polishing
    Shi, Limin
    Niu, Yongjiang
    Ma, Yongfeng
    Liu, Erliang
    MECHATRONICS AND INTELLIGENT MATERIALS, PTS 1 AND 2, 2011, 211-212 : 416 - +
  • [6] New microscopic polishing with magnetic compound fluid (MCF)
    Shimada, K
    Akagami, Y
    Kamiyama, S
    Fujita, T
    Miyazaki, T
    Shibayama, A
    JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES, 2002, 13 (7-8) : 405 - 408
  • [7] ELECTROCHEMICAL POLISHING
    EPELBOIN, I
    GARREAU, M
    GALVANOTECHNIK, 1978, 69 (06): : 494 - 501
  • [8] The polishing mechanism of electrochemical mechanical polishing technology
    Lee, SJ
    Lee, YM
    Du, MF
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2003, 140 : 280 - 286
  • [9] POLISHING COMPOUND SEMICONDUCTORS
    JENSEN, EW
    SOLID STATE TECHNOLOGY, 1973, 16 (08) : 49 - 52
  • [10] Polishing inner capillary walls by a magnetic compound fluid
    Nishida, Hitoshi
    Shimada, Kunio
    Goto, Makoto
    INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS, 2007, 25 (1-4) : 25 - 29
12345