Readers flip for flip chip

被引：0
|
作者：
Ryu, CM [1 ]
机构：
[1] Arizona State Univ, EE Dept, Tempe, AZ 85287 USA
来源：
SOLID STATE TECHNOLOGY | 1998年 / 41卷 / 09期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：18 / 18
页数：1
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