Enhanced pseudo-atomic layer deposition of antimony telluride thin films by co-injecting NH3 gas with both precursors

被引:0
|
作者
Jeon, Sangmin
Jeon, Jeong Woo
Choi, Wonho
Park, Byongwoo
Jeon, Gwangsik
Yoo, Chanyoung [1 ]
Hwang, Cheol Seong [1 ]
机构
[1] Seoul Natl Univ, Dept Mat Sci & Engn, Seoul 08826, South Korea
基金
新加坡国家研究基金会;
关键词
SB2TE3; TEMPERATURE;
D O I
10.1039/d3tc00007a
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work proposed an enhanced deposition method of antimony telluride (Sb2Te3) thin films, which allowed facile growth at high temperatures (> 150 degrees C). The enhancement was enabled by co-injecting NH3 gas with Sb- and Te-precursors. An in-depth analysis of the deposition mechanism revealed that the Sb-precursor (Sb(OC2H5)(3)) and NH3 gas reacted to form an Sb-O/Sb-Sb layer, which was then converted to Sb2Te3 upon the injection of the Te-precursor (Te(Si(CH3)(3))(2)) and NH3 gas. Thus, a pseudo-atomic layer deposition (pseudo-ALD) component was incorporated into the deposition process, which led to growth per cycle (GPC) enhancement. The deposited films were of high density, contained low amounts of impurities, and had a preferential out-of-plane c-axis orientation when deposited on SiO2 substrates. Despite the pseudo-ALD process, conformal deposition on extreme nanoscale structures was demonstrated.
引用
收藏
页码:3726 / 3735
页数:11
相关论文
共 50 条
  • [1] Reaction Mechanism Underlying Atomic Layer Deposition of Antimony Telluride Thin Films
    Han, Byeol
    Kim, Yu-Jin
    Park, Jae-Min
    Yusup, Luchana L.
    Ishii, Hana
    Lansalot-Matras, Clement
    Lee, Won-Jun
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 16 (05) : 4924 - 4928
  • [2] Metalorganic atomic layer deposition of TiN thin films using TDMAT and NH3
    Kim, HK
    Kim, JY
    Park, JY
    Kim, Y
    Kim, YD
    Jeon, H
    Kim, WM
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2002, 41 (05) : 739 - 744
  • [3] Growth mechanism of Co thin films formed by plasma-enhanced atomic layer deposition using NH3 as plasma reactant
    Oh, Il-Kwon
    Kim, Hyungjun
    Lee, Han-Bo-Ram
    CURRENT APPLIED PHYSICS, 2017, 17 (03) : 333 - 338
  • [4] Atomic Layer Deposition of Antimony Telluride Thin Films using (Me3Si)2Te with SbCl3 as Precursors
    Gu, Diefeng
    Nminibapiel, David
    Baumgart, Helmut
    Robinson, Hans
    Kochergin, Vladimir
    ATOMIC LAYER DEPOSITION APPLICATIONS 7, 2011, 41 (02): : 255 - 261
  • [5] Remote plasma-enhanced atomic layer deposition of gallium oxide thin films with NH3 plasma pretreatment
    Hao, Hui
    Chen, Xiao
    Li, Zhengcheng
    Shen, Yang
    Wang, Hu
    Zhao, Yanfei
    Huang, Rong
    Liu, Tong
    Liang, Jian
    An, Yuxin
    Peng, Qing
    Ding, Sunan
    JOURNAL OF SEMICONDUCTORS, 2019, 40 (01)
  • [6] Remote plasma-enhanced atomic layer deposition of gallium oxide thin films with NH3 plasma pretreatment
    Hui Hao
    Xiao Chen
    Zhengcheng Li
    Yang Shen
    Hu Wang
    Yanfei Zhao
    Rong Huang
    Tong Liu
    Jian Liang
    Yuxin An
    Qing Peng
    Sunan Ding
    Journal of Semiconductors, 2019, 40 (01) : 97 - 103
  • [7] Effect of the amido Ti precursors on the atomic layer deposition of TiN with NH3
    Cho, Gihee
    Rhee, Shi-Woo
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2013, 31 (01):
  • [8] Atomic layer deposition of ultra-thin tan films using TBTDET and NH3
    Kim, KC
    Anderson, TJ
    Advanced Metallization Conference 2005 (AMC 2005), 2006, : 451 - 455
  • [9] Atomic layer deposition of TiN thin films by sequential introduction of Ti precursor and NH3
    Min, JS
    Son, YW
    Kang, WG
    Kang, SW
    ADVANCED INTERCONNECTS AND CONTACT MATERIALS AND PROCESSES FOR FUTURE INTEGRATED CIRCUITS, 1998, 514 : 337 - 342
  • [10] Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
    Sari, Windu
    Eom, Tae-Kwang
    Kim, Soo-Hyun
    Kim, Hoon
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (01) : D42 - D47