Circuits for 5G RF front-end modules

被引:2
|
作者
Balteanu, Florinel [1 ]
机构
[1] Skyworks Solut Inc, 5260 Calif Ave, Irvine, CA 92617 USA
关键词
Envelope tracking; fifth generation wireless (5G); load modulation; power amplifier; silicon on insulator (SOI); POWER-AMPLIFIER; ARCHITECTURE; PERFORMANCE;
D O I
10.1017/S1759078722001295
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless(5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps) and low latency (<1 ms). 5G requires more RF bandwidth and therefore an increase in the number of components such as RF switches, acoustic filters, and power amplifiers integrated in few RF front-end modules. Also, there is an increase in the number of RF radio transmitters and receivers operating at the same time. This paper presents new architecture elements for 5G RF front-end modules. Circuit details and measurements are presented to reduce the RF noise, improve the efficiency, and help the coexistence of multiple radio transmitters. These circuits will help extend the 5G applications with radar-like sensing applications, remote medicine, and autonomous driving.
引用
收藏
页码:909 / 924
页数:16
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