An ultrasensitive three-dimensional structured multi-mode sensor for out-of-plane forces

被引:5
|
作者
Ding, Li [1 ]
Wu, Dinghao [1 ]
Wei, Yanjie [2 ]
Liu, Siyong [1 ]
He, Ge [1 ]
Gong, Xinglong [3 ]
Zhang, Dongsheng [1 ]
机构
[1] Shanghai Univ, Shanghai Inst Appl Math & Mech, Sch Mech & Engn Sci, Shanghai 200444, Peoples R China
[2] Shijiazhuang Tiedao Univ, Dept Engn Mech, Shijiazhuang 050043, Peoples R China
[3] Univ Sci & Technol China USTC, CAS Ctr Excellence Complex Syst Mech, Dept Modern Mech, CAS Key Lab Mech Behav & Design Mat, Hefei 230027, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Sensor; Multi; -modal; Multifunctional material; Smart material; Out of plane; STRETCHABLE ELECTRONICS; SKIN; SOFT;
D O I
10.1016/j.cej.2023.141786
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
This work presents an ultrasensitive three-dimensional (3D) structured sensor with out-of-plane tactility and non -contact perception capabilities. It is composed of flexible silver nanowire-patterned magnetic film and the printed heat-responsive polymer skeleton by means of spin-coating, masking, and printing technologies. Besides the capabilities in detecting tension, compression, shear, and even air vibration/flow, the 3D-structured sensor also exhibits the advantages of prompt response, super flexibility, outstanding sensitivity, high reversibility and stability. The responsive relative resistance variations of the 3D-structured sensor exhibit an excellent linear relationship with the pull-out/press-in forces, and the sensitivities are estimated as 21.8 % N-1 and-19.6 % N-1, respectively. Furthermore, it is demonstrated that the applied direction and strength of shear excitation can be well predicted via applying machine learning methods. Moreover, the sensor is able to clearly detect the loading paths of external excitations, including the load waveform and even the initial phase. Notably, the normalized resistance of the sensor changes with the magnetic flux density which is promising in tuning the sensitivity of the sensor within a magnetic field. The exceptional multi-mode sensing characteristics demonstrate that the 3D -structured sensor possess great potentials for implementation in next-generation smart devices or systems.
引用
收藏
页数:11
相关论文
共 50 条
  • [1] In-plane and out-of-plane characteristics of three-dimensional textile composites
    Takatoya, T
    Susuki, I
    [J]. JOURNAL OF COMPOSITE MATERIALS, 2005, 39 (06) : 543 - 556
  • [2] Three-dimensional REF model of tire including the out-of-plane vibration
    Wei Y.-T.
    Liu Z.
    Zhou F.-Q.
    Zhao C.-L.
    [J]. Zhendong Gongcheng Xuebao/Journal of Vibration Engineering, 2016, 29 (05): : 795 - 803
  • [3] Out-of-plane modes in three-dimensional Fabry-Perot microlasers
    Sobeshchuk, N.
    Guidry, M. A.
    Lafargue, C.
    Gashemi, R.
    Decanini, D.
    Zyss, J.
    Lebental, M.
    [J]. APPLIED PHYSICS LETTERS, 2018, 112 (26)
  • [4] A three-dimensional macroelement for modelling the in-plane and out-of-plane response of masonry walls
    Vanin, Francesco
    Penna, Andrea
    Beyer, Katrin
    [J]. EARTHQUAKE ENGINEERING & STRUCTURAL DYNAMICS, 2020, 49 (14): : 1365 - 1387
  • [5] Three-dimensional Rashba spin splitting dominated by out-of-plane spin polarization
    Xie, Rongrong
    Cao, Panfeng
    Xu, Zheyuan
    Xu, Boyi
    Fu, Jinyue
    Zhu, Xiaoli
    Fu, Xianwei
    Xie, Sheng-Yi
    Jiang, Ying
    Pan, Anlian
    [J]. PHYSICAL REVIEW B, 2023, 107 (15)
  • [6] Three-dimensional behavior of embedded anchor lines under out-of-plane loading
    Liu, Haixiao
    Xiong, Jun
    Zhao, Yanbing
    [J]. APPLIED OCEAN RESEARCH, 2018, 79 : 134 - 148
  • [7] Three-dimensional nanoplasmonic surfaces with strong out-of-plane electric field enhancement
    Gungor, Kivanc
    Unal, Emre
    Demir, Hilmi Volkan
    [J]. 2013 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2013,
  • [8] Three-dimensional Rashba spin splitting dominated by out-of-plane spin polarization
    Xie, Rongrong
    Cao, Panfeng
    Xu, Zheyuan
    Xu, Boyi
    Fu, Jinyue
    Zhu, Xiaoli
    Fu, Xianwei
    Xie, Sheng-Yi
    Jiang, Ying
    Pan, Anlian
    [J]. Physical Review B, 2023, 107 (15):
  • [9] Three-dimensional analyses of unified characterization parameter of in-plane and out-of-plane creep constraint
    Ma, H. S.
    Wang, G. Z.
    Liu, S.
    Tu, S. T.
    Xuan, F. Z.
    [J]. FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, 2016, 39 (02) : 251 - 263
  • [10] Nanowire-Mesh-Templated Growth of Out-of-Plane Three-Dimensional Fuzzy Graphene
    Garg, Raghav
    Rastogi, Sahil K.
    Lamparski, Michael
    de la Barrera, Sergio C.
    Pace, Gordon T.
    Nuhfer, Noel T.
    Hunt, Benjamin M.
    Meunier, Vincent
    Cohen-Karni, Tzahi
    [J]. ACS NANO, 2017, 11 (06) : 6301 - 6311