Optical fiber links based A thermal planar AWG for ultrahigh thermal stability and ultralow thermal sensitivity

This paper has clarified the optical fiber links in the presence of proposed device structures for ultrahigh thermal stability and ultralow thermal sensitivity. The study is clarified to design a thermal planar arrayed waveguide grating (AWG)-based SiO2, LiNbO3 and Ga(1-x)Al(x)As core material. Plastic cladding material is based on polyhexafluoro isopropyl 2-fluoroacrylate dibutyl phathalate (PHFIP 2-FA-DBP). Plastic polyhexafluoro isopropyl 2-fluoroacrylate (PHFIP 2-FA) material is used as under-cladding material. These hybrid materials are integrated on a silicon (Si) substrate. The performance parameters of this device have been investigated in the range of the simulation parameters. We have investigated a thermal AWG devices design signature for ultrahigh thermal stability and ultralow thermal sensitivity. The refractive index dependence of the various plastic materials used as over-/under-cladding is clarified versus wavelength variations.