A temperature and process compensation circuit for resistive-based in-memory computing arrays

被引:3
|
作者
Monga, Dipesh C. [1 ]
Numan, Omar [1 ]
Andraud, Martin [1 ]
Halonen, Kari [1 ]
机构
[1] Aalto Univ, Sch Elect Engn, Dept Elect & Nanoengn, Espoo, Finland
基金
芬兰科学院;
关键词
Thermal compensation; process compensation; ultra-low power; variable temperature coefficient; In-memory computing; Resistive random access memory;
D O I
10.1109/ISCAS46773.2023.10181619
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
In-Memory Computing (IMC) architectures promise increased energy-efficiency for embedded artificial intelligence. Many IMC circuits rely on analog computation, which is more sensitive to process and temperature variations than digital. Thus, maintaining a suitable computation accuracy may require process and temperature compensation. Focusing on resistive-based IMC architectures, we propose an ultra-low power circuit to compensate for the temperature and process-based non-linearities of resistive computing elements. The proposed circuit, implemented in 65 nm CMOS can provide a temperature coefficient between 10 and 1938 ppm/degrees C for a wide temperature range (-40 degrees C to 80 degrees C) and output current range (few pA up to 600 nA) at 1.2 V operating voltage. Used in a resistive IMC array, the variation of output currents from each multiply-accumulate (MAC) operation can be reduced by up to 84% to maintain computation accuracy across process and temperature variations.
引用
收藏
页数:5
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