Automatic Defect Classification (ADC) solution using Data-Centric Artificial Intelligence (AI) for outgoing quality inspections in the semiconductor industry

被引:0
|
作者
Anilturk, Onder [1 ]
Lumanauw, Edwin [1 ]
Bird, James [1 ]
Olloniego, Juan [2 ]
Laird, Dillon [2 ]
Fernandez, Juan Camilo [2 ]
Killough, Quinn [2 ]
机构
[1] NXP Semicond, Austin, TX 78721 USA
[2] Landing AI, Palo Alto, CA USA
关键词
Defect; Wafer; Yield; Semiconductor; Artificial Intelligence; Machine Vision; Deep Learning; Data Centric;
D O I
10.1117/12.2658434
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, we present an automatic defect classification (ADC) application for outgoing quality inspections. In most outgoing inspections, all of the defects were manually classified to reject or accept the inspected die with the defect classification. Earlier adoption of ADC systems usually emphasizes both accuracy (recall) and purity (precision) as output metrics to deploy the system to classify the defects. In our implementation, purity is targeted as the main output metric for the classification of clearly defined defects in the training set. This allowed us to deploy an automatic defect classification solution with high purity and benefit from its automatic classification earlier in the adoption process with an immediate impact on workload reduction, while progressively tuning performance on less pure defect classes. Overall, higher than 80% purity levels are achieved on more than 75% of the population of all the defects assigned for classification. Several ad-hoc monitoring systems; such as time-window based statistical tests and subject-matter-expert (SME) based performance of ground truth, are implemented for the continuity of the performance of the classifier.
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页数:7
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