Economic Aspects of Mechanical Pre-Treatment's Role in Precious Metals Recovery from Electronic Waste

Printed circuit boards (PCBs) make up 3 to 5% of all electronic waste. The metal content of spent PCBs can reach 40%. They usually contain valuable metals, such as Ag, Au, and Pd, as well as other metals such as Cu, Sn, Pb, Cd, Cr, Zn, Ni, and Mn. However, the metallic part of a whole PCB is 40-60% including the Cu layers between the fiberglass-polymer layers. The paper describes the economics of the valuable metal (Ag, Au, Pd)-containing concentrate preparation from a raw PCB. We considered the influence of the pre-treatment method of PCBs before the extraction of valuable metals on the extraction self-cost change. The disintegration method is based on the high-energy impact of the particles of the material to be ground, thus causing the separation of the metallic components of the PCB. In the course of the work, single and double direct grinding using the method of disintegration was studied. For the calculation, the test batch of 10,000 kg of two types of PCB was taken for estimation of the self costs and potential profit in the case of complete valuable metals (Ag, Au, Pd) plus Cu extraction. It was shown that from 10,000 kg of studied PCB, it is possible to obtain 1144 and 1644 kg of metal-rich concentrate, which should be further subjected to electro-hydrochlorination for metals leaching. The novelty of this research lies in the fact that a technical and economic analysis has been carried out on a newly developed combined technology for processing electronic waste. This included mechanical processing and electrochemical leaching with the help of the active chlorine that is formed in situ. The real (not specially selected or prepared) waste PCBs were used for the process's economical efficiency evaluation. The main findings showed that despite the high content of Cu in the studied PCBs, the commercial value was insignificant in relation to the total income from the Ag, Au, and Pd sale. A correlation was established between the self-cost decrease after separative disintegration of PCBs by metal content increase (by specific metals such as Au, Ag, Pd, and Cu) with the metal potential yield after extraction.