Thermal Interface Materials with Hexagonal Boron Nitride and Graphene Fillers in PDMS Matrix: Thermal and Mechanical Properties

被引:1
|
作者
Fakiridis, Spyridon [1 ]
Hodge, Stephen A. [2 ]
Karagiannidis, Panagiotis G. [1 ]
机构
[1] Univ Sunderland, Fac Technol, Sch Engn, Sunderland SR6 0DD, England
[2] Versarien, Unit 1,Longhope Business Pk, Longhope GL17 0QZ, Glos, England
关键词
graphene; hexagonal boron nitride; PDMS; thermal interface materials; mechanical properties; curing inhibition; elastomers; POLYDIMETHYLSILOXANE COMPOSITES; SILICONE-RUBBER; CONDUCTIVITY; NETWORK; NANOCOMPOSITES; ENHANCEMENT; PERFORMANCE; FABRICATION; MANAGEMENT; EFFICIENCY;
D O I
10.3390/en16062522
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
This work studies the effects of graphene nanoplatelets (GNPs) and hexagonal boron nitride (hBN) on the thermal and mechanical properties of polydimethylsiloxane (PDMS) matrix for use as thermal interface materials (TIMs). Solution mixing of 10 wt% GNPs and 40 wt% hBN with PDMS produced TIMs with through-plane thermal conductivity (TC) of 1.24 W m(-1) K-1 showing a 519% increase relative to the neat matrix. A synergistic effect between GNPs and hBN was particularly demonstrated when in samples with 48 wt% total filler content, 8 wt% hBN was replaced by GNPs, and the TC was increased by 33%. The elongation at break of the hBN (40 wt%)/GNP (8 wt%) samples reached 151%, representing a 160% increase when compared to samples with only 40 wt% hBN. Moreover, the shore hardness of samples containing 40 wt% hBN was 68 A, and the introduction of 8 wt% GNPs caused a decrease to 38 A. DSC measurements on samples filled with hBN and GNPs showed a reduction up to 65% in Ultimate Heat of Curing, which was attributed to the presence of graphene flakes interfering with the curing of the matrix. Graphene was found to be an efficient filler in tuning the thermal and mechanical properties of TIMs.
引用
收藏
页数:17
相关论文
共 50 条
  • [1] A comparative study of the thermal interface materials with graphene and boron nitride fillers
    Kargar, F.
    Salgado, R.
    Legedza, S.
    Renteria, J.
    Balandin, A. A.
    CARBON NANOTUBES, GRAPHENE, AND ASSOCIATED DEVICES VII, 2014, 9168
  • [2] Thermal interface conductance across a graphene/hexagonal boron nitride heterojunction
    Chen, Chun-Chung
    Li, Zhen
    Shi, Li
    Cronin, Stephen B.
    APPLIED PHYSICS LETTERS, 2014, 104 (08)
  • [3] Mechanical and thermal properties of grain boundary in a planar heterostructure of graphene and hexagonal boron nitride
    Li, Yinfeng
    Wei, Anran
    Ye, Han
    Yao, Haimin
    NANOSCALE, 2018, 10 (07) : 3497 - 3508
  • [4] Enhancing tribo-mechanical properties and thermal stability of nylon 6 by hexagonal boron nitride fillers
    Randhawa, Kawaljit Singh
    Patel, Ashwin D.
    E-POLYMERS, 2020, 20 (01) : 733 - 745
  • [5] Effect of Defects on the Thermal Transport across the Graphene/Hexagonal Boron Nitride Interface
    Li, Maoyuan
    Zheng, Bing
    Duan, Ke
    Zhang, Yun
    Huang, Zhigao
    Zhou, Huamin
    JOURNAL OF PHYSICAL CHEMISTRY C, 2018, 122 (26): : 14945 - 14953
  • [6] Effect of strain and defects on the thermal conductance of the graphene/hexagonal boron nitride interface
    Song, Jieren
    Xu, Zhonghai
    He, Xiaodong
    Cai, Chaocan
    Bai, Yujiao
    Miao, Linlin
    Wang, Rongguo
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2020, 22 (20) : 11537 - 11545
  • [7] Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
    Ji, Yuan
    Han, Shi-Da
    Wu, Hong
    Guo, Shao-Yun
    Zhang, Feng-Shun
    Qiu, Jian-Hui
    CHINESE JOURNAL OF POLYMER SCIENCE, 2024, 42 (03) : 352 - 363
  • [8] Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
    Yuan Ji
    Shi-Da Han
    Hong Wu
    Shao-Yun Guo
    Feng-Shun Zhang
    Jian-Hui Qiu
    Chinese Journal of Polymer Science, 2024, 42 : 352 - 363
  • [9] Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
    Yuan Ji
    Shi-Da Han
    Hong Wu
    Shao-Yun Guo
    Feng-Shun Zhang
    Jian-Hui Qiu
    Chinese Journal of Polymer Science, 2024, 42 (03) : 352 - 363
  • [10] Thermal Percolation Threshold and Thermal Properties of Composites with High Loading of Graphene and Boron Nitride Fillers
    Kargar, Fariborz
    Barani, Zahra
    Salgado, Ruben
    Debnath, Bishwajit
    Lewis, Jacob S.
    Aytan, Ece
    Lake, Roger K.
    Balandin, Alexander A.
    ACS APPLIED MATERIALS & INTERFACES, 2018, 10 (43) : 37555 - 37565