Comprehensive Investigation of Constant Voltage Stress Time-Dependent Breakdown and Cycle-to-Breakdown Reliability in Y-Doped and Si-Doped HfO2 Metal-Ferroelectric-Metal Memory

被引:0
|
作者
Chang, Ting-Yu [1 ]
Wang, Kuan-Chi [1 ]
Liu, Hsien-Yang [2 ]
Hseun, Jing-Hua [3 ]
Peng, Wei-Cheng [1 ]
Ronchi, Nicolo [4 ]
Celano, Umberto [4 ,5 ]
Banerjee, Kaustuv [4 ]
Van Houdt, Jan [4 ,6 ]
Wu, Tian-Li [1 ,2 ,3 ]
机构
[1] Natl Yang Ming Chiao Tung Univ, Int Coll Semicond Technol, Hsinchu 30010, Taiwan
[2] Natl Yang Ming Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan
[3] Natl Yang Ming Chiao Tung Univ, Inst Pioneer Semicond Innovat, Hsinchu 30010, Taiwan
[4] Imec, B-3000 Leuven, Belgium
[5] Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA
[6] Katholieke Univ Leuven, Dept Phys & Astron, B-3000 Leuven, Belgium
关键词
ferroelectric; domain size; reliability; TRANSISTORS;
D O I
10.3390/nano13142104
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In this study, we comprehensively investigate the constant voltage stress (CVS) time-dependent breakdown and cycle-to-breakdown while considering metal-ferroelectric-metal (MFM) memory, which has distinct domain sizes induced by different doping species, i.e., Yttrium (Y) (Sample A) and Silicon (Si) (Sample B). Firstly, Y-doped and Si-doped HfO2 MFM devices exhibit domain sizes of 5.64 nm and 12.47 nm, respectively. Secondly, Si-doped HfO2 MFM devices (Sample B) have better CVS time-dependent breakdown and cycle-to-breakdown stability than Y-doped HfO2 MFM devices (Sample A). Therefore, a larger domain size showing higher extrapolated voltage under CVS time-dependent breakdown and cycle-to-breakdown evaluations was observed, indicating that the domain size crucially impacts the stability of MFM memory.
引用
收藏
页数:9
相关论文
共 4 条
  • [1] Demonstration of Large Polarization in Si-doped HfO2 Metal-Ferroelectric-Insulator-Semiconductor Capacitors with Good Endurance and Retention
    Hsuen, Jing-Hua
    Lederer, Maximillian
    Kerkhofs, Lars
    Raffel, Yannick
    Pirro, Luca
    Chohan, Talha
    Seidel, Konrad
    Kaempfe, Thomas
    De, Sourav
    Wu, Tian-Li
    2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT, 2023,
  • [2] Degradation and breakdown of 0.9 nm EOT SiO2/ALD HfO2/metal gate stacks under positive constant voltage stress
    Degraeve, R
    Kauerauf, T
    Cho, M
    Zahid, M
    Ragnarsson, LÅ
    Brunco, DP
    Kaczer, B
    Roussel, P
    De Gendt, S
    Groeseneken, G
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST, 2005, : 419 - 422
  • [3] Investigation of temperature-dependent ferroelectric properties of Y-doped HfO2 thin film prepared by medium-frequency reactive magnetron co-sputtering
    Zhang, Yu
    Xu, Jun
    Choi, Chi-Kyu
    Fang, Zhen-Xing
    Li, Ping
    Yuan, Longfei
    Chen, Lei
    VACUUM, 2020, 179
  • [4] Time-Dependent Dielectric Breakdown of La2O3-Doped High-k/Metal Gate Stacked NMOSFETs
    Han, In-Shik
    Choi, Won-Ho
    Kwon, Hyuk-Min
    Na, Min-Ki
    Zhang, Ying-Ying
    Kim, Yong-Goo
    Wang, Jin-Suk
    Kang, Chang Yong
    Bersuker, Gennadi
    Lee, Byoung Hun
    Jeong, Yoon Ha
    Lee, Hi-Deok
    Jammy, Raj
    IEEE ELECTRON DEVICE LETTERS, 2009, 30 (03) : 298 - 301