High-throughput determination of interdiffusivity in fcc Cu-Al-Sn and Cu-Ni-Al-Sn alloys

In this paper, 6 Cu-Al-Sn ternary and 8 Cu-Ni-Al-Sn quaternary solid diffusion couples within single fcc phase from 1023 K to 1173 K were fabricated. Employing the measured concentration profiles and interdiffusion fluxes, the atomic mobility parameters and interdiffusion coefficients in Cu-Al-Sn and Cu-Ni-Al-Sn systems were high-throughput evaluated using the numerical inverse method. The simulated composition distributions and interdiffusion fluxes in all the diffusion couples are consistent with the measured ones confirming the reliability of the atomic mobilities. The Matano-Kirkaldy method was also used to validate the reliability of the accuracy of the determined interdiffusion matrices. The 3D diagrams of main interdiffusivities in the Cu-Al-Sn and Cu-Ni-Al-Sn systems in the investigated ranges of composition and temperature were established to analyze the effects of components on the diffusivities. In the Cu-Al-Sn system, there is an increase in (D) over tilde (Cu)(AlAl) with an increase in xAl, while (D) over tilde (Cu)(SnSn) increases with increasing x(Sn) but decreases with the addition of Al. Additionally, the introduction of Ni results in a decrease in all the main interdiffusivities ((D) over tilde (Cu)(NiNi), (D) over tilde (Cu)(AlAl) and (D) over tilde (Cu)(SnSn)) in the Cu-Ni-Al-Sn system.