Interfacial Catalytic Mechanism of the Oxidation Reactions of SF6 Primary Decomposition Products by Cu Surface

被引:0
|
作者
Li, Haotian [1 ]
Zeng, Fuping [1 ]
Su, Dazhi [1 ]
Zhu, Kexin [1 ]
Cai, Rijian [1 ]
Yao, Qiang [2 ]
Tang, Ju [1 ]
机构
[1] Wuhan Univ, Sch Elect Engn & Automat, Wuhan 430072, Peoples R China
[2] State Grid Chongqing Elect Power Co, Elect Power Res Inst, Chongqing 401123, Peoples R China
基金
中国国家自然科学基金;
关键词
Catalysis; Cu; gas-insulated switchgear (GIS); oxidation; SF6; thermal decomposition; CO2; HYDROGENATION; SULFUR; DISSOCIATION; ADSORPTION; MOLECULES; EXCHANGE; METHANOL; CU(111); SOLIDS; FAULT;
D O I
10.1109/TDEI.2023.3322385
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Operational experience shows that the thermal stability of SF6 in gas-insulated switchgear (GIS) is lower than expected. Metallic copper inside the equipment may have a significant catalytic effect on the primary decomposition and secondary reactions of SF6, while the catalytic mechanism has not been explored. To this end, the article calculated and obtained the adsorption configuration of O-2 on the Cu(111) surface based on density functional theory (DFT). A model was established for the reaction of low-fluorine sulfide with O and O-2 on the Cu surface, which initially revealed the oxidation mechanism of SF6 primary decomposition products on the Cu surface under the GIS over-thermal fault. Further, based on transition state (TS) theory and chemical kinetics analysis, the article compared the interfacial reactions' energy barriers and rate constants with the corresponding gas-phase reactions. This way, the main reaction sites of four essential oxidation reaction pathways were identified. The catalytic /inhibitory mechanism of the Cu interface on the reaction was also analyzed. This study fills the gap in the research on the surface reaction mechanism during SF6 decomposition under GIS failure.
引用
收藏
页码:2750 / 2757
页数:8
相关论文
共 50 条
  • [1] Surface reactions of SF6 decomposition products
    Piemontesi, M
    Niemeyer, L
    [J]. IEEE 1996 ANNUAL REPORT - CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS I & II, 1996, : 585 - 593
  • [2] THERMODYNAMICS OF SF6 AND ITS DECOMPOSITION AND OXIDATION PRODUCTS
    WILKINS, RL
    [J]. JOURNAL OF CHEMICAL PHYSICS, 1969, 51 (02): : 853 - &
  • [3] Study on the mechanism and influencing factors of SF6 decomposition products
    Fu, Lijun
    Guan, Yanling
    Zhang, Liang
    Jin, Haiquan
    Wang, Han
    Jing, Yuanchi
    [J]. 2020 INTERNATIONAL SYMPOSIUM ON ENERGY ENVIRONMENT AND GREEN DEVELOPMENT, 2021, 657
  • [4] Theoretical study of the decomposition mechanism of SF6/Cu gas mixtures
    Fu, Yuwei
    Wang, Xiaohua
    Yang, Aijun
    Rong, Mingzhe
    Duan, Jiandong
    [J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2018, 51 (42)
  • [5] PROMOTERS AND MECHANISMS OF SF6 OXIDATION REACTIONS
    SIEGEL, B
    BREISACH.P
    [J]. JOURNAL OF INORGANIC & NUCLEAR CHEMISTRY, 1970, 32 (05): : 1469 - &
  • [6] Interfacial reactions between SF6 and molten magnesium
    Walzak, MJ
    Davidson, RD
    McIntyre, NS
    Argo, D
    Davis, BR
    [J]. MAGNESIUM TECHNOLOGY 2001, 2001, : 37 - 41
  • [7] Analysis of the Thermal Decomposition Path of SF6 on the Surface of Cu and its Oxides
    Fuping Zeng
    Kexin Zhu
    Xiaoyue Chen
    Haotian Li
    Xinnuo Guo
    Xiaoxuan Feng
    Long Li
    Qiang Yao
    Ju Tang
    [J]. Plasma Chemistry and Plasma Processing, 2022, 42 : 1361 - 1380
  • [8] Analysis of the Thermal Decomposition Path of SF6 on the Surface of Cu and its Oxides
    Zeng, Fuping
    Zhu, Kexin
    Chen, Xiaoyue
    Li, Haotian
    Guo, Xinnuo
    Feng, Xiaoxuan
    Li, Long
    Yao, Qiang
    Tang, Ju
    [J]. PLASMA CHEMISTRY AND PLASMA PROCESSING, 2022, 42 (06) : 1361 - 1380
  • [9] NEUTRAL DECOMPOSITION PRODUCTS IN SPARK BREAKDOWN OF SF6
    SAUERS, I
    ELLIS, HW
    CHRISTOPHOROU, LG
    [J]. IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1986, 21 (02): : 111 - 120
  • [10] Sorption of SF6 and SF6 decomposition products by activated alumina and molecular sieve 13X
    Piemontesi, M
    Niemeyer, L
    [J]. CONFERENCE RECORD OF THE 1996 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATION, VOLS 1 AND 2, 1996, : 828 - 838