Thermal and Wettability Properties of Nanoclay-Filled Epoxy-Based Foam Composite as Lightweight Material

被引:1
|
作者
Ajayi, Ayodele Abraham [1 ]
Pandurangan, Mohan Turup [1 ]
Kanny, Krishnan [1 ]
Ramachandran, Velmurugan [2 ]
机构
[1] Durban Univ Technol, Dept Mech Engn, Composite Res Grp, Steve Biko Campus, ZA-4000 Durban, South Africa
[2] Indian Inst Technol, Dept Aerosp Engn, Madras 600036, India
基金
新加坡国家研究基金会;
关键词
hollow glass microspheres; clay; fillers; foam composite; wettability; thermal properties; WALLED CARBON NANOTUBE; ABSORPTION;
D O I
10.1520/MPC20230085
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Epoxy-based foam composite (EBFC) materials have received considerable attention recently because of their wide range of applications in the aerospace and marine industries. EBFC materials made from hybrid fillers are materials generated to have improved thermal properties. This work focuses on improving the thermal properties and wettability of EBFC materials with hybridized fillers by infusing hollow glass microspheres (HGM) and clay. The HGM content varied between 1 weight percent (wt.%) and 5 wt.% in foam composite materials while clay content varied between 1 wt.% and 5 wt.% in each of the HGM-filled series of foam composite materials. These foam composite materials were fabricated using a conventional resin casting method. The thermal properties, such as thermal conductivity, thermal expansion, coefficient of thermal expansion, as well as specific heat capacity, water contact angles, and percentage of water absorption of hybrid-filled foam composite materials were investigated and compared with neat epoxy and epoxy foam materials. It was found that hybrid-filled foam composite materials exhibited improved thermal properties over neat epoxy material because of good chemical reactions and excellent interfacial adhesion between the fillers and matrix. These improved thermal properties may suggest that this material may be suitable for application in industries where lightweight materials with good thermal properties are required. This reveals a new area in foam composite manufacturing research by enhancing thermal properties with hybrid fillers.
引用
收藏
页码:293 / 306
页数:15
相关论文
共 50 条
  • [1] Morphological, Thermal and Mechanical Properties of Nanoclay-Filled Polyethylene Oxide Nanocomposites
    Saeed, Khalid
    Ishaq, Mohammad
    Ahmad, Imtiaz
    Shakirullah, Mohammad
    Latifullah
    JOURNAL OF THE CHEMICAL SOCIETY OF PAKISTAN, 2013, 35 (03): : 699 - 702
  • [2] Mode I interlaminar fracture behavior and mechanical properties of CFRPs with nanoclay-filled epoxy matrix
    Siddiqui, Naveed A.
    Woo, Ricky S. C.
    Kim, Jang-Kyo
    Leung, Christopher C. K.
    Munir, Arshad
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2007, 38 (02) : 449 - 460
  • [3] Montmorillonite Nanoclay Filler Effects on Electrical Conductivity, Thermal and Mechanical Properties of Epoxy-Based Nanocomposites
    Renukappa, Rashmi N. M.
    Chikkakuntappa, Ranganathaiah
    Kunigal, N. Shivakumar
    POLYMER ENGINEERING AND SCIENCE, 2011, 51 (09): : 1827 - 1836
  • [4] Flexural Properties of Epoxy and Epoxy-Based CFRP Filled with Carbon Nanotubes
    Glaskova, T.
    Aniskevich, A.
    Zarrelli, M.
    Martone, A.
    Giordano, M.
    9TH INTERNATIONAL CONFERENCE ON COMPOSITE SCIENCE AND TECHNOLOGY: 2020 - SCIENTIFIC AND INDUSTRIAL CHALLENGES, 2013, : 344 - 355
  • [5] Preparation, morphology and thermal/mechanical properties of epoxy/nanoclay composite
    Wang, Lei
    Wang, Ke
    Chen, Ling
    Zhang, Yongwei
    He, Chaobin
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2006, 37 (11) : 1890 - 1896
  • [6] Bulk cure study of nanoclay filled epoxy glass fiber reinforced composite material
    Olusanya, John
    Kanny, Krishnan
    Singh, Shalini
    JOURNAL OF POLYMER ENGINEERING, 2017, 37 (03) : 247 - 259
  • [7] Electrical Properties of Epoxy-based Nanocomposites Filled with Graphene Oxide
    Zhang, Siyu
    Zhang, Hongliang
    Peng, Zongren
    2016 IEEE INTERNATIONAL CONFERENCE ON DIELECTRICS (ICD), VOLS 1-2, 2016, : 108 - 111
  • [8] Physicochemical, mechanical and electrical properties of epoxy-based syntactic foam under thermal and hydrothermal aging conditions
    Li, Le
    Dai, Xiaohan
    Li, Yanda
    Zhou, Songsong
    Liu, Hechen
    Ma, Yunfan
    Zhang, Zhongyuan
    Liu, Yunpeng
    MATERIALS TODAY COMMUNICATIONS, 2022, 33
  • [9] Evaluation of mechanical properties of bamboo epoxy bio-composite filled with Montmorillonite Nanoclay
    Kirve, Mayuri
    Munde, Yashwant
    Shinde, Avinash
    Siva, I.
    MATERIALS TODAY-PROCEEDINGS, 2022, 62 : 806 - 810
  • [10] Thermal characterization of an epoxy-based underfill material for flip chip packaging
    He, Y
    Moreira, BE
    Overson, A
    Nakamura, SH
    Bider, C
    Briscoe, JF
    THERMOCHIMICA ACTA, 2000, 357 : 1 - 8