Special Issue on Condition Monitoring and Diagnostics of Electrical Insulation

被引：0

作者：

Florkowski, Marek ^{[1
]}

Pan, Cheng ^{[2
]}

机构：

[1] AGH Univ Krakow, Dept Elect & Power Engn, Al Mickiewicza 30, PL-30059 Krakow, Poland

[2] Wuhan Univ, Sch Elect Engn & Automat, Bayi Rd 299,Wuchang Dist, Wuhan 430072, Peoples R China

来源：

IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION | 2023年 / 30卷 / 05期

关键词：

D O I：

10.1109/TDEI.2023.3316335

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：2439 / 2439

页数：1

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