Electrospinning of epoxy fibers: Effect of curing conditions on solution rheological behavior

被引:0
|
作者
Takaya, Junji [1 ,2 ]
Higashino, Hirohiko [1 ]
Takaya, Ryuzo [1 ]
Sakaguchi, Hiromi [1 ]
Tanoue, Jitsuo [1 ]
Higashide, Takashi [1 ]
Moriguchi, Hisako [1 ]
Nakao, Masatoshi [1 ]
Takai, Yasuyuki [1 ]
机构
[1] Osaka Med Assoc, Sch Phys Sect, Osaka, Japan
[2] Kawachi Gen Hosp, Dept Pediat, 1-31 Yokomakura, Higashi Osaka, Osaka 5780954, Japan
基金
以色列科学基金会;
关键词
crosslinking; electrospinning; epoxy; rheology; thermoset; viscosity; MOLECULAR-SIZE DISTRIBUTION; CROSS-LINKING POLYMER;
D O I
10.1002/app.54437
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The electrospinning of thermoplastic polymers is widely used in applications such as filters and coatings, but has only recently been applied to thermosetting polymers because of their chemical structure and reactivity. Epoxy is a thermosetting polymer which, when combined with a curing agent, chemically reacts to form a crosslinked matrix. In the present study, we demonstrate that to electrospin epoxy and obtain continuous micro and nanofibers, one must precisely control the curing reaction. Epoxy was mixed with triamine curing agent and, to enable electrospinnability, was dissolved in a mixture of tetrahydrofuran and dimethylformamide solvents. We identified a narrow working window wherein a proper solution for electrospinning is close to the gel point, right before the transition from liquid to solid gel state. The solution was characterized by means of (i) Fourier-transform infrared spectroscopy to monitor the extent of reaction, (ii) steady shear viscosity to detect the divergence near the gel point, and (iii) oscillatory loss and storage shear moduli to identify the liquid-to-gel transition. Based on these measurements, it was possible to monitor the chemical transformations that the epoxy solution underwent with time, such as chemical interconnections and gelation, and thus define the working window for electrospinning.
引用
收藏
页数:10
相关论文
共 50 条
  • [1] Electrospinning of epoxy fibers: Effect of curing conditions on solution rheological behavior
    Shneider, Mark
    Zattelman, Rotem
    Kaestner, Antonia
    Greenfeld, Israel
    Wagner, Hanoch Daniel
    Journal of Applied Polymer Science, 2023, 140 (38):
  • [2] Effect of Curing Agent and Temperature on the Rheological Behavior of Epoxy Resin Systems
    Zhao, Chenhui
    Zhang, Guangcheng
    Zhao, Lei
    MOLECULES, 2012, 17 (07): : 8587 - 8594
  • [3] Solution rheological behavior and electrospinning of cationic polyelectrolytes
    McKee, MG
    Hunley, MT
    Layman, JM
    Long, TE
    MACROMOLECULES, 2006, 39 (02) : 575 - 583
  • [4] Electrospinning of epoxy fibers
    Shneider, M.
    Sui, X. M.
    Greenfeld, I
    Wagner, H. D.
    POLYMER, 2021, 235 (235)
  • [5] RHEOLOGICAL BEHAVIOR OF EPOXY ACRYLATE PREPOLYMER DURING UV CURING
    OTSUBO, Y
    AMARI, T
    WATANABE, K
    JOURNAL OF APPLIED POLYMER SCIENCE, 1984, 29 (12) : 4071 - 4080
  • [6] Investigation of the Curing Kinetics and Rheological Behavior of Multifunctional Epoxy Resin System
    Zhou Zhengwei
    Bai Ruicheng
    Ren Musu
    Sun Jinliang
    Zhou Ze
    Hu Qingping
    Wang Chuanbin
    POLYMERS & POLYMER COMPOSITES, 2011, 19 (4-5): : 345 - 349
  • [7] Effect of Additives on the Rheological Properties of Fast Curing Epoxy Resins
    Wang, Youjiang
    Lakho, Dildar Ali
    Yao, Donggang
    EPITOANYAG-JOURNAL OF SILICATE BASED AND COMPOSITE MATERIALS, 2015, 67 (04): : 132 - 134
  • [8] The solution curing performance of high-ortho epoxy phenolic fibers
    Jiao, Mingli
    Yang, Kai
    Ren, Dongxue
    Diao, Quan
    Cao, Jian
    Liu, Hongyan
    Yu, Muhuo
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2017, 31 (16-19):
  • [9] Rheological monitoring of curing reaction of an epoxy system:: effect of heating rate
    Velázquez, P
    González-Alvarez, A
    González-Romero, VM
    Arellano, M
    POLYMER BULLETIN, 2000, 43 (06) : 519 - 526
  • [10] Effect of Nanoplatelets on the Rheological Behavior of Epoxy Monomers
    Sun, Luyi
    Boo, Woong-Jae
    Liu, Jia
    Clearfield, Abraham
    Sue, Hung-Jue
    Verghese, Nikhil E.
    Pham, Ha Q.
    Bicerano, Jozef
    MACROMOLECULAR MATERIALS AND ENGINEERING, 2009, 294 (02) : 103 - 113