Effect of Heating Atmosphere Composition and Content on Phase and Morphology Distribution of Copper Oxide Layer

被引:0
|
作者
Lv, Chufeng [1 ]
Guo, Yue [1 ]
Zhao, Jian [2 ]
Dai, Fangqin [1 ]
Zeng, Weidong [1 ]
Liu, Ming [2 ]
机构
[1] Wuhan Univ Sci & Technol, State Key Lab Refractories & Met, 947 Heping Ave, Wuhan, Hubei, Peoples R China
[2] China Copper Huazhong Copper CO LTD, Special 1,Tongxin Rd, Huangshi, Hubei, Peoples R China
关键词
Copper billet; High-temperature oxidation; Water vapor; Carbon dioxide; Cupric oxide; Cuprous oxide; HIGH-TEMPERATURE OXIDATION; CU; CORROSION; MECHANISM; CO2;
D O I
10.1007/s11085-024-10237-y
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
When a copper billet is heated in the rolling reheating furnace, certain oxides that affect the surface quality may persist on the substrate. This study investigates the effects of heating atmosphere compositions (N2, O2, CO2, and H2O) and contents on the micro-morphology and phase evolution of the copper oxides. The results revealed that O2 is the primary factor contributing to the formation of nodules on the copper surface. The primary phase of the exfoliated oxides was CuO attached to Cu2O, and the nodular oxides also consisted of CuO that directly adhere to copper matrix. Additionally, water vapor can increase the number of Cu2O particles on the interface between exfoliated oxide and copper matrix, effectively reducing the number of residual nodular oxides. Finally, water vapor and its dissociation products effectively eliminated the pores within the oxide layer and at the oxide-matrix interface, while CO2 increased the porosity within the oxide layer.
引用
收藏
页码:209 / 210
页数:2
相关论文
共 50 条
  • [1] Effect of surface oxide film and atmosphere on microwave heating of compacted copper powder
    Sueyoshi, Hidekazu
    Hashiguchi, Tomokazu
    Nakatsuru, Nobuhiro
    Kakiuchi, Shigeki
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 2011, 125 (03) : 723 - 728
  • [2] Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere
    Zhang, Lei
    Sun, Guangwei
    Li, Li
    Shang, J. K.
    [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 250 - +
  • [3] Effect of copper oxide on microwave heating of copper powder
    Sueyoshi, H.
    Honbo, T.
    [J]. POWDER METALLURGY, 2009, 52 (01) : 12 - 16
  • [4] Effect of Fluoride Content on Morphology and Phase Composition of ZrO2 Nanotubes
    Xu Ying
    Liu Xuan-Yong
    Ding Chuan-Xian
    [J]. JOURNAL OF INORGANIC MATERIALS, 2012, 27 (01) : 107 - 112
  • [5] Effect of Calcinations on Morphology of Electrospun Copper and Copper Oxide nanofibers
    Khadem, Dariush Jafar
    Yaakob, Zahira
    Shahgaldi, Samaneh
    Daud, Wan Ramli Wan
    Majlan, Edy Herianto
    [J]. ADVANCES IN MECHANICAL ENGINEERING, PTS 1-3, 2011, 52-54 : 1884 - 1889
  • [6] MORPHOLOGY AND PHASE TRANSFORMATION OF COPPER/ALUMINIUM OXIDE FILMS
    Panthawan, A.
    Kumpika, T.
    Sroila, W.
    Kantarak, E.
    Thongpan, W.
    Pooseekheaw, P.
    Sornphanpee, R.
    Jumrus, N.
    Sanmuangmoon, P.
    Tuantranont, A.
    Singjai, P.
    Thongsuwan, W.
    [J]. UKRAINIAN JOURNAL OF PHYSICS, 2018, 63 (05): : 425 - 430
  • [7] Effect of supercritical drying parameters on the phase composition and morphology of aerogels based on vanadium oxide
    S. V. Balakhonov
    S. Z. Vatsadze
    B. R. Churagulov
    [J]. Russian Journal of Inorganic Chemistry, 2015, 60 : 9 - 15
  • [8] Effect of supercritical drying parameters on the phase composition and morphology of aerogels based on vanadium oxide
    Balakhonov, S. V.
    Vatsadze, S. Z.
    Churagulov, B. R.
    [J]. RUSSIAN JOURNAL OF INORGANIC CHEMISTRY, 2015, 60 (01) : 9 - 15
  • [9] Effect of carbon content on mechanoreduction of copper oxide
    Liu, L
    Yuan, SL
    Dong, YD
    Cui, K
    [J]. CHINESE PHYSICS LETTERS, 1999, 16 (08) : 591 - 593
  • [10] Effect of carbon content on mechanoreduction of copper oxide
    Stt. Key Lab. Plast. Forming S., Huazhong Univ. of Sci. and Technol., Wuhan 430074, China
    不详
    不详
    [J]. Chin. Phys. Lett., 8 (591-593):