An Analytical MOS Device Model With Mismatch and Temperature Variation for Subthreshold Circuits

被引:5
|
作者
Benjamin, Ben Varkey [1 ,2 ]
Smith, Richelle L. L. [1 ]
Boahen, Kwabena A. A. [3 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[2] Dexterity Inc, Engn Dept, Redwood City, CA 94063 USA
[3] Stanford Univ, Dept Bioengn & Elect Engn, Stanford, CA 94305 USA
关键词
CMOS; fully-depleted silicon-on-insulator (FDSOI); integrated circuit; neuromorphic engineering; semiconductor device modeling; subthreshold; weak inversion; COMPACT MODEL; LETI-UTSOI2.1;
D O I
10.1109/TCSII.2023.3234009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Subthreshold analog circuits are attractive for low-power, large-scale neuromorphic systems. However, subthreshold currents are exponentially sensitive to temperature and device mismatch, and a compact model that accounts for these effects is needed. We develop an analytical compact model with mismatch and temperature variation for subthreshold MOS devices. The model only requires an initial set of Monte Carlo (MC) simulations on individual devices for parameter extraction. Then the designer can use its parameterized analytical expressions for circuit design, instead of running repeated MC simulations on large circuits. We apply this model to a subthreshold current mirror design example. Good agreement between the developed model and Spectre simulations is achieved in a 28-nm fully-depleted silicon-on-insulator (FDSOI) process. The model is general and can also guide the design of other subthreshold circuits, such as low-power silicon neurons. It has been used to design Braindrop, the first neuromorphic chip programmed at a high level of abstraction.
引用
收藏
页码:1826 / 1830
页数:5
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