Thermal Digital Twin of Power Electronics Modules for Online Thermal Parameter Identification

被引:3
|
作者
Kuprat, Johannes [1 ]
Debbadi, Karthik [2 ]
Schaumburg, Joscha [1 ]
Liserre, Marco [1 ,2 ]
Langwasser, Marius [1 ]
机构
[1] Univ Kiel, Chair Power Elect, D-24143 Kiel, Germany
[2] Fraunhofer Inst Silicon Technol ISIT, D-25524 Itzehoe, Germany
关键词
Temperature measurement; Topology; Real-time systems; Behavioral sciences; Thermal degradation; Semiconductor device measurement; Power electronics; Digital twins (DTs); semiconductor device reliability; thermal analysis; RELIABILITY; CONVERTERS; TEMPERATURE; CAPACITORS; MANAGEMENT; DEVICES; MODELS;
D O I
10.1109/JESTPE.2023.3328219
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The assessment of the state of health of power semiconductors and the use of thermal observers rely on precise knowledge of the thermal impedance of the device, which is hard to monitor online with state-of-the-art approaches. This work proposes thermal digital twins (DTs), which create a real-time-capable digital replica of the physical thermal behavior and enable monitoring the thermal impedance online. The particle swarm optimization (PSO) algorithm and the dual extended Kalman filter (DEKF) are used to extract the thermal model for online monitoring. This is demonstrated for both approaches via a real-time simulation (RTS) where the reference chip temperature is given by a digital thermal model. A comparison of the approaches is given and the DEKF-based approach is chosen for the implementation of a multichip model with thermal cross-coupling. The convergence of the DEKF-based DTs is experimentally validated in the laboratory.
引用
收藏
页码:1020 / 1029
页数:10
相关论文
共 50 条
  • [1] Implementation of Online Digital Twin Framework for Thermal Power Plant
    Guan, Shiqi
    Hu, Wenshan
    Zhou, Hong
    [J]. PROCEEDINGS OF THE 10TH INTERNATIONAL CONFERENCE ON ENERGY ENGINEERING AND ENVIRONMENTAL ENGINEERING, ICEEEE 2023, 2024, : 187 - 198
  • [2] Active thermal control of power electronics modules
    Murdock, DA
    Ramos, JE
    Connors, J
    Lorenz, RD
    [J]. 2003 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-3: CROSSROADS TO INNOVATIONS, 2003, : 1511 - 1515
  • [3] A Quasi-online Method of Thermal Network Parameter Identification for IGBT Modules
    Li, Tengfei
    Du, Xiong
    Zeng, Cheng
    Sun, Pengju
    Tai, Heng-Ming
    [J]. 2016 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2016,
  • [4] Thermal design and optimization methodology for integrated power electronics modules
    Pang, YF
    Scott, EP
    Chen, JZ
    Thole, KA
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2005, 127 (01) : 59 - 66
  • [5] On the Transient Thermal Characteristics of Silicon Carbide Power Electronics Modules
    Mandrusiak, Gary
    She, Xu
    Waddell, Alistair Martin
    Acharya, Sayan
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 33 (11) : 9783 - 9789
  • [6] Electrical and thermal layout design considerations for integrated power electronics modules
    Chen, JZ
    Pang, YF
    Boroyevich, D
    Scott, EP
    Thole, KA
    [J]. CONFERENCE RECORD OF THE 2002 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2002, : 242 - 246
  • [7] Thermal evaluation of DC/DC and PFC integrated power electronics modules
    Pang, YF
    Scott, EP
    [J]. ITHERM 2004, VOL 1, 2004, : 700 - 705
  • [8] Thermal Stress Characterization of Power Electronics with Digital Image Correlation
    Wijaya, Andi
    Moeller, Eike
    Wilde, Juergen
    [J]. 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,
  • [9] Novel approach of twin-side thermal interfacing of integrated power modules for reduced thermal impedance
    Chang, Jie Jay
    Liao, Changming
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2006, 21 (03) : 625 - 632
  • [10] Online thermal parameter identification for permanent magnet synchronous machines
    Xiao, Shuai
    Griffo, Antonio
    [J]. IET ELECTRIC POWER APPLICATIONS, 2020, 14 (12) : 2340 - 2347