WEDM one-step preparation of miniature heat sink with superhydrophobic and efficient heat transfer performance

There is an urgent need for miniature heat sinks with superhydrophobic and efficient heat transfer properties for power-intensive electronic devices to operate properly under harsh conditions. Therefore, this paper firstly establishes the simulation model of surface wetting performance of miniature heat sink with square columnar array microstructure based on the phase field method and investigates the effect of dimensional parameters on the surface wetting performance of miniature heat sink. Then, miniature heat sinks with square columnar array microstructures of different dimensional parameters were prepared by wire electrical discharge machining (WEDM), and the 2D micromorphology, surface wetting performance, and heat transfer performance of the miniature heat sinks were characterized. The experimental results show that the simulation model has a high accuracy and the difference between the experimental results is less than 4.1%. The contact angle of the miniature heat sink with column width, column distance, and column height of 400 mu m, 400 mu m, and 1000 mu m, respectively, is 151.4 degrees. The heat source temperature with this miniature heat sink installed is 109.5 degrees C, which is 32.1 degrees C lower than the heat source temperature of 141.6 degrees C with the polished purple copper block installed without microstructure, a reduction of up to 22.7%. The miniature heat sink is prepared by WEDM in one-step, without any chemical modification treatment, to obtain super hydrophobic and efficient heat transfer performance.