Residual Life Prediction of Low-Voltage Circuit Breaker Thermal Trip Based on the Wiener Process

被引:0
|
作者
Su, Xiuping [1 ,2 ]
Wang, Linlin [1 ,2 ]
Zhang, Zhilin [1 ,2 ]
Wang, Dongyue [1 ,2 ]
机构
[1] Hebei Univ Technol, Prov & Ministerial Coconstruct Collaborat Innovat, Tianjin 300130, Peoples R China
[2] Hebei Univ Technol, Key Lab Electromagnet Field & Elect Appliance Reli, Tianjin 300130, Peoples R China
基金
中国国家自然科学基金;
关键词
thermal trip; Wiener process; performance degradation; residual life prediction;
D O I
10.3390/en17051189
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
A low-voltage circuit breaker thermal trip plays a role in power systems, including opening and closing, control, protection, and more. Their reliability directly affects the security and stability of the power distribution system. The Wiener process model is established according to the accelerated degradation data of thermal trips, and remaining life prediction is carried out. In this paper, firstly, the constant stress accelerated degradation test is carried out on a thermal trip with temperature as the accelerated stress and specific thermal deflection as the degradation eigenquantity to characterise the degradation trajectory according to the degradation data and analyse the degradation law; then, it is verified by the test of normal distribution that the degradation data of the thermal trip conform to the Wiener process. The Wiener process, using the great likelihood estimation method to estimate the parameters of the remaining life, calculates the remaining life probability density function and reliability function under different temperature stresses and obtains the remaining life of the thermal trip under each accelerated stress conditions; finally, the remaining life of the thermal trip at the initial moment is taken as the pseudo-failure life, and the Arrhenius accelerated model is utilised to launch the external thermal trip under normal stress. Finally, the Arrhenius acceleration model is used to extrapolate the lifespan of the thermal trip under normal stress.
引用
收藏
页数:14
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