A Modular Approach of an Electromagnetic Compatibility Test System for Integrated Circuits

被引：1

作者：

Kircher, Daniel ^{[1
]}

Deutschmann, Bernd ^{[1
]}

Profanter, Simon ^{[1
]}

机构：

[1] Graz Univ Technol, Inst Elect IFE, Graz, Austria

来源：

2023 AUSTROCHIP WORKSHOP ON MICROELECTRONICS, AUSTROCHIP | 2023年

关键词：

Integrated Circuit (IC); Electromagnetic Compatibility (EMC); Modular Test System; Radio Frequency (RF); Reusable;

D O I：

10.1109/Austrochip61217.2023.10285156

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To bring automotive integrated circuits (ICs) to market, manufacturers must subject their products to numerous electromagnetic compatibility (EMC) tests such as electromagnetic immunity and emission tests, or electrostatic discharge (ESD) tests. These tests need EMC test boards that meet the specific standards' requirements. However, the current need to increase the frequency range of EMC tests poses a challenge in designing standard-compliant test boards. In this paper, we address this issue by introducing a modular and reusable IC level EMC test system. We demonstrate the system's effectiveness with an example of a direct power injection (DPI) test setup. It is shown how the frequency range can be expanded while minimizing costs and design efforts for the EMC test board design.

引用

页码：19 / 22

页数：4

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