A 57.6 Gb/s Wireless Link based on 26.4 dBm EIRP D-band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm

被引：6

作者：

Gonzalez-Jimenez, Jose Luis ^{[1
]}

Siligaris, Alexandre ^{[1
]}

Hamani, Abdelaziz ^{[1
]}

Foglia-Manzillo, Francesco ^{[1
]}

Courouve, Pierre ^{[1
]}

Cassiau, Nicolas ^{[1
]}

Dehos, Cedric ^{[1
]}

Clemente, Antonio ^{[1
]}

机构：

[1] Univ Grenoble Alpes, CEA, Leti, Grenoble, France

来源：

2023 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM, RFIC | 2023年

关键词：

D-band; wireless-link; 16-QAM; CMOS; 45nm;

D O I：

10.1109/RFIC54547.2023.10186148

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

This paper presents a baseband to D-band wireless link based on a transmitter module integrating a 45-nm CMOS channel bonding chipset and a high-gain antenna in PCB technology. The link realized using a commercial receiver at 42 cm achieves a data rate of 57.6 Gb/s using a multi-channel 16-QAM with a transmitting energy efficiency of 27.4 pJ/b.

引用

页码：97 / 100

页数：4

共 12 条

[1] A D-Band Transmitter Achieving 57.6-Gb/s and 30-dBm EIRP Based on Channel-Aggregation 45-Nm ICs and a Low-Profile Flat Lens Antenna
Gonzalez-Jimenez, Jose Luis
Manzillo, Francesco Foglia
Hamani, Abdelaziz
Siligaris, Alexandre
Cassiau, Nicolas
Clemente, Antonio
Courouve, Pierre
Chaix, Fabrice
Dehos, Cedric
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2024, 72 (01) : 836 - 850
[2] A 5Gb/s F-band ASK Transmitter in 45nm LP CMOS
Deferm, Noel
Osorio, Juan F.
de Graauw, Anton
Reynaert, Patrick
2013 8TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2013, : 296 - 299
[3] A 40Gb/s Optical NRZ Transmitter Based on Monolithic Microring Modulators in 45nm SOI CMOS
Lin, Sen
Moazeni, Sajjad
Stojanovic, Vladimir
2018 IEEE SYMPOSIUM ON VLSI CIRCUITS, 2018, : 273 - 274
[4] A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS
Siligaris, A.
Courouve, P.
Waltener, G.
Hamani, A.
Dehos, C.
Gonzalez-Jimenez, J. L.
2023 IEEE 23RD TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, 2023, : 4 - 7
[5] A 56.32 Gb/s 16-QAM D-band Wireless Link using RX-TX Systems-in-Package with Integrated Multi-LO Generators in 45nm RFSOI
Hamani, Abdelaziz
Foglia Manzillo, Francesco
Siligaris, Alexandre
Cassiau, Nicolas
Hameau, Frederic
Chaix, Fabrice
Dehos, Cedric
Clemente, Antonio
Gonzalez-Jimenez, Jose Luis
2022 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC), 2022, : 75 - 78
[6] A Dual-Channel 15 Gb/s PRBS Generator for a D-Band PMCW Radar Transmitter in 22 nm FDSOI
Probst, Florian
Engelmann, Andre
Koch, Manuel
Weigel, Robert
2023 IEEE WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE, WAMICON, 2023,
[7] A 40Gb/s PAM-4 Transmitter Based on a Ring-Resonator Optical DAC in 45nm SOI CMOS
Moazeni, Sajjad
Lin, Sen
Wade, Mark T.
Alloatti, Luca
Ram, Rajeev J.
Popovic, Milos A.
Stojanovic, Vladimir
2017 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC), 2017, : 486 - 486
[8] A 56.32 Gb/s 16-QAM Link over Dielectric Fiber using a D-band Channel Bonding Transceiver
Jimenez, J. L. Gonzalez
Martineau, B.
Hamani, A.
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Foglia Manzillo, F.
Hameau, F.
Dehos, C.
2021 51ST EUROPEAN MICROWAVE CONFERENCE (EUMC), 2021, : 197 - 200
[9] A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology
Hamani, Abdelaziz
Manzillo, Francesco Foglia
Siligaris, Alexandre
Cassiau, Nicolas
Blampey, Benjamin
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2022, 70 (07) : 3385 - 3395
[10] A 84.48-Gb/s 64-QAM CMOS D-Band Channel-Bonding Tx Front-End With Integrated Multi-LO Frequency Generation
Hamani, Abdelaziz
Siligaris, Alexandre
Barrera, Fernando
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Gary, Marjorie
Jimenez, Jose Luis Gonzalez
IEEE SOLID-STATE CIRCUITS LETTERS, 2020, 3 : 346 - 349

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