Straightforward Manufacturing of 3D-Printed Metallic Structures toward Customized Electrical Components

被引:0
|
作者
Lee, Dongmin [1 ]
Kim, So-Young [2 ]
Jeong, Gwajeong [1 ]
Lee, Woo Sung [1 ]
Lee, Wonho [2 ]
Yang, Hyunseung [1 ]
机构
[1] Korea Elect Technol Inst, Elect Convergence Mat & Device Res Ctr, Seongnam 13509, Gyeonggi Do, South Korea
[2] Kumoh Natl Inst Technol, Dept Polymer Sci & Engn, Dept Energy Engn Convergence, Gumi 39177, Gyeongbuk, South Korea
基金
新加坡国家研究基金会;
关键词
3D printing; metalization; DLP; thiol-ene-acrylate; electroless plating; SILVER NANOPARTICLES; CURE DEPTH; 3D; COPPER; DEPOSITION; CHEMISTRY; PHOTOPOLYMERIZATION; ADSORPTION; ULTRALIGHT; ELECTRODE;
D O I
10.1021/acsami.3c04121
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Metalizing three-dimensional (3D)-printed polymers hasbeen spotlightedin the field of manufacturing high-end and customized electrical components.Conventional metalization approaches that rely on the electrolessplating (ELP) process typically require the use of noble metal-basedcatalysts or involve multistep processes, limiting their practicalapplications. Herein, we propose a straightforward yet effective approachto manufacture 3D-printed polymers with conductive metal layers througha thiol-mediated ELP process without involving an additional catalyticactivation process. A photocurable ternary resin based on thiol-ene-acrylatemonomers was precisely designed to induce excess thiol moieties onthe surface of 3D-printed structures. These exposed thiol moietiesserved as active sites for metal ion complexion via strong metal-sulfurbonds, allowing the deposition of metal layers on the 3D-printed polymersthrough the ELP. Diverse metal layers, including Cu, Ag, and NiP,could be deposited onto virtually any 3D-printed structures with highuniformity and adhesion stability. To highlight the potential applicationof our approach, we fabricated fully functional glucose sensors throughthe deposition of the Cu layer on 3D-printed electrode models, andthese sensors displayed excellent nonenzymatic glucose sensing performance.The proposed approach offers great insights for designing functionalmetallic structures and opens up new avenues for manufacturing lightweight,customized electrical components.
引用
收藏
页码:31765 / 31775
页数:11
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