Special Issue on COOL Chips

被引：0
|
作者：
Egawa, Ryusuke [1 ]
Wada, Yasutaka [2 ]
机构：
[1] Tokyo Denki Univ, Tokyo 1208551, Japan
[2] Meisei Univ, Tokyo 1918506, Japan
来源：
IEEE MICRO | 2024年 / 44卷 / 01期
关键词：
Special issues and sections; Low-power electronics; Chip scale packaging; High-speed electronics; Performance evaluation; Energy consumption;
D O I：
10.1109/MM.2024.3353949
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.
引用
收藏
页码：6 / 7
页数：2
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