Electron microscopy study of the impact of solution treatment on the corrosion behavior of an Al-Zn-Mg-Cu alloy

被引:4
|
作者
Tang, Huizhen [1 ]
Zhang, Yongchao [1 ,2 ,4 ]
Sun, Yanrong [1 ]
Wang, Shuai [1 ]
Yan, Lijuan [1 ]
Shen, Jun [2 ,3 ]
Ge, Binghui [1 ,4 ]
机构
[1] Anhui Univ, Inst Phys Sci & Informat Technol, Informat Mat & Intelligent Sensing Lab Anhui Prov, Key Lab Struct & Funct Regulat Hybrid Mat,Minist E, Hefei 230601, Anhui, Peoples R China
[2] Binzhou Inst Technol, Binzhou 256600, Shandong, Peoples R China
[3] Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China
[4] Anhui Univ, Chime Garden Campus, Hefei, Anhui, Peoples R China
基金
中国国家自然科学基金;
关键词
Al -Zn -Mg -Cu alloy; Solution treatment; Passive film; Corrosion behavior; Segregation; INTERGRANULAR CORROSION; LOCALIZED CORROSION; ALUMINUM;
D O I
10.1016/j.corsci.2023.111665
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An Al-Zn-Mg-Cu alloy treated at 475 degrees C for 1 h was found to have improved corrosion resistance compared to non-solution-treated ones. Corrosion preferentially occurred in the matrix adjacent to second phases. Nonsolution-treated samples showed varying passive film thickness and uneven solute segregation along the metal/film interface, resulting in sites susceptible to localized corrosion. Solution treatment minimized second phases, promoted uniform passive film thickness and uniform solute segregation, generating a high density of nanoscale pits during early corrosion. Our results demonstrated the metal/film interface's crucial role in alloy corrosion, offering insights for improving corrosion resistance via heat treatments and interface engineering.
引用
收藏
页数:10
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