Cellular Automata Simulation of Dynamic Recrystallization Behavior of TC21 Titanium Alloy

被引：0
|
作者：
Yue, Sun [1 ]
Yong, Sun [1 ]
Yong, Yang [1 ]
Chao, Yuan [1 ]
Ling Yunhan [1 ]
机构：
[1] Beijing Res Inst Mech & Elect Technol Co Ltd, CAM, Beijing 100083, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2023年 / 52卷 / 09期
关键词：
TC21 titanium alloy; thermal deformation; cellular automata model; dynamic recrystallization; grain size model; GRAIN-BOUNDARY MIGRATION; DEFORMATION; MICROSTRUCTURE; KINETICS; PROGRESS; MODEL;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In order to study the effect of different deformation parameters of thermal processing on the microstructure of TC21 titanium alloy during plastic forming, isothermal constant strain rate thermal compression experiments were performed on the thermal simulation testing machine, and the thermal deformation behavior of TC21 titanium alloy under different deformation conditions was studied. Based on the microstructure evolution of TC21 titanium alloy during thermal compression, a cellular automata was established by the derivation of dislocation density model, recrystallization nucleation and grain growth model of TC21 titanium alloy. Based on the cellular automaton model, the dynamic recrystallization behavior TC21 titanium alloy during deformation in the beta single-phase region was simulated and verified. The results show that the flow stress of the alloy increases with the decrease in temperature and the increase in strain rate; according to the analysis of cellular automata simulation results, the dynamic recrystallization volume fraction of the alloy is positively proportional to the deformtion temperature and inversely proportional to the strain rate.
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页码：3139 / 3146
页数：8
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