Steady-State Temperature-Sensitive Electrical Parameters' Characteristics of GaN HEMT Power Devices

被引:3
|
作者
Wang, Kaihong [1 ]
Zhu, Yidi [2 ]
Zhao, Hao [2 ]
Zhao, Ruixue [3 ]
Zhu, Binxin [2 ]
机构
[1] China Three Gorges Univ, Hubei Prov Key Lab Operat & Control Cascaded Hydro, Yichang 443002, Peoples R China
[2] China Three Gorges Univ, Hubei Prov Engn Technol Res Ctr Intelligent Energy, Yichang 443002, Peoples R China
[3] Hefei Technol Coll, Coll Rail Transit, Hefei 238010, Peoples R China
关键词
GaN HEMT; reliability; temperature-sensitive electrical parameters; junction temperature monitoring; VOLTAGE;
D O I
10.3390/electronics13020363
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Gallium nitride high-electron-mobility transistor (GaN HEMT) power devices are favored in various scenarios due to their high-power density and efficiency. However, with the significant increase in the heat flux density, the junction temperature of GaN HEMT has become a crucial factor in device reliability. Since the junction temperature monitoring technology for GaN HEMT based on temperature-sensitive electrical parameters (TSEPs) is still in the exploratory stage, the TSEPs' characteristics of GaN HEMT have not been definitively established. In this paper, for the common steady-state TSEPs of GaN HEMT, the variation rules of the saturation voltage with low current injection, threshold voltage, and body-like diode voltage drop with temperature are investigated. The influences on the three TSEPs' characteristics are considered, and their stability is discussed. Through experimental comparison, it is found that the saturation voltage with low current injection retains favorable temperature-sensitive characteristics, which has potential application value in junction temperature measurement. However, the threshold voltage as a TSEP for certain GaN HEMT is not ideal in terms of linearity and stability.
引用
收藏
页数:15
相关论文
共 50 条
  • [1] An Investigation of Temperature-Sensitive Electrical Parameters for SiC Power MOSFETs
    Gonzalez, Jose Ortiz
    Alatise, Olayiwola
    Hu, Ji
    Ran, Li
    Mawby, Philip A.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (10) : 7954 - 7966
  • [2] Comparative Study of Temperature Sensitive Electrical Parameters (TSEP) of Si, SiC and GaN Power Devices
    Zhang, Liqi
    Liu, Pengkun
    Guo, Suxuan
    Huang, Alex Q.
    [J]. 2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2016, : 302 - 307
  • [3] Investigation of Dynamic Temperature-Sensitive Electrical Parameters for Medium-Voltage SiC and Si Devices
    Ni, Ze
    Zheng, Sheng
    Chinthavali, Madhu Sudhan
    Cao, Dong
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2021, 9 (05) : 6408 - 6423
  • [4] Steady-state algorithm for switching power electronic devices
    Contreras-Sampayo, JC
    Usaola-García, J
    Wood, AR
    [J]. IEE PROCEEDINGS-ELECTRIC POWER APPLICATIONS, 2001, 148 (03): : 245 - 250
  • [5] Measurement of temperature-sensitive electrical parameters of a high-power 4.5 kV IGBT module
    Hoeer, Martin
    Meissner, Markus
    Bernet, Steffen
    [J]. 2018 20TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'18 ECCE EUROPE), 2018,
  • [6] Steady-state optimization in power systems with series FACTS devices
    Orfanogianni, T
    Bacher, R
    [J]. IEEE TRANSACTIONS ON POWER SYSTEMS, 2003, 18 (01) : 19 - 26
  • [7] A Study on the Dynamic Switching Characteristics of p-GaN HEMT Power Devices
    Fan, Chen
    Zhang, Haitao
    Liu, Huipeng
    Pan, Xiaofei
    Yan, Su
    Chen, Hongliang
    Guo, Wei
    Cai, Lin
    Wei, Shuhua
    [J]. MICROMACHINES, 2024, 15 (08)
  • [8] DETERMINATION OF STEADY-STATE TEMPERATURE RISES OF POWER TRANSFORMERS
    GODEC, Z
    [J]. IEE PROCEEDINGS-A-SCIENCE MEASUREMENT AND TECHNOLOGY, 1987, 134 (10): : 773 - 778
  • [9] Modelling temperature dependence on AlGaN/GaN power HEMT device characteristics
    Wang, Yun-Hsiang
    Liang, Yung C.
    Samudra, Ganesh S.
    Chang, Ting-Fu
    Huang, Chih-Fang
    Yuan, Li
    Lo, Guo-Qiang
    [J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2013, 28 (12)
  • [10] THE PARAMETERS OF STEADY-STATE DEFORMATION IN THE POWER-LAW REGIME
    SIETHOFF, H
    [J]. SCRIPTA METALLURGICA ET MATERIALIA, 1992, 27 (01): : 7 - 12