Development of high performance 2.5D packaging using glass interposer with through glass vias

2.5D interposer technology has gotten a lot of attention as a viable solution to high IO density, cost, and performance challenges. Glass is a potential choice as an interposer material in an integrated package, with low dielectric loss and simple processing, it can be a low-cost alternative to silicon interposer. In this paper, a 2.5D package using glass interposer with a size of 10 mm x 15 mm x 0.8 mm is developed. The interposer with through glass via (TGV) technology simplifies the process and dramatically reduces manufacturing costs, which is especially important for the system in package. Several key processes are developed and discussed. To optimize the wafer level warpage problem, finite element modeling is used to simulate the warpage of glass wafers and optimize the process parameters and material parameters. Finally, the package level reliability tests are conducted on the 2.5D packages, after pro-conditional level 3 and temperature cycling tests, and the final packages pass the reliability tests without significant failure mode, which provides an important reference value for the subsequent mass-production of the TGV interposer.