Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints at low temperatures

被引：1
|
作者：
Li, W. Y. [1 ,2 ]
Chen, F. [1 ]
Gui, J. [1 ]
He, S. L. [1 ]
Qin, H. B. [1 ]
Huang, J. Q. [1 ]
机构：
[1] Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guangxi Educ Dept Key Lab Microelect Packaging & A, Guilin 541004, Peoples R China
[2] Osaka Univ, Flexible 3D Syst Integrat Lab, Mihogaoka 8-1, Osaka, Ibaraki 5670047, Japan
来源：
MICROELECTRONICS RELIABILITY | 2023年 / 150卷
基金：
中国国家自然科学基金;
关键词：
Solder joints; Low temperature; Shear performance; Ductile-to-brittle transition; Size effect; SOLDER JOINTS; MECHANICAL-PROPERTIES; THERMAL-EXPANSION; RELIABILITY;
D O I：
10.1016/j.microrel.2023.115093
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To assess the serving reliability of shrinking-sized solder joints in space electronics (especially cryogenic electronics), the effects of joint size on the shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu joints with ball grid array (BGA) structure at different temperatures (25 to -125 degrees C) were investigated. As the joint size decreased, shear strength of the solder joint increased, showing prominent size effect, which was enhanced at low temperatures. Moreover, a ductile-to-brittle transition (DBT) fracture occurred as the test temperature declined, and the critical temperature decreased as the joint size decreased. All of the results suggest that the small-sized joints are more robust at low temperatures under shear loading.
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页数：8
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