Thermoconductive Graphene Fluoride Cross-Linked Aramid Nanofiber Composite Films with Enhanced Mechanical Flexibility and Flammable Retardancy for Thermal Management in Wearable Electronics

被引:8
|
作者
Nguyen, Duy Khiem [1 ,2 ]
Tran, Thi Thu Hien [3 ,4 ]
Mai, Thi Kieu Lien [3 ]
Tran, Minh-Sang [5 ]
Ghotekar, Suresh [6 ]
Pham, Ai Le Hoang [7 ]
Nguyen, Van-Cuong [7 ]
Vu, Minh Canh [8 ]
机构
[1] Duy Tan Univ, Inst Res & Dev, Ctr Adv Chem, Da Nang 550000, Vietnam
[2] Duy Tan Univ, Fac Nat Sci, Da Nang 550000, Vietnam
[3] Univ Da Nang, Univ Sci & Educ, Da Nang 550000, Vietnam
[4] Univ Phan Thiet, Sch Business, Binh Thuan 800000, Vietnam
[5] Univ Da Nang, Univ Sci & Technol, Fac Mech Engn, Da Nang 550000, Vietnam
[6] Chettinad Hosp & Res Inst, Chettinad Acad Res & Educ, Fac Allied Hlth Sci, Kelambakkam 603103, Tamil Nadu, India
[7] Ind Univ Ho Chi Minh City, Fac Chem Engn, Ho Chi Minh City 700000, Vietnam
[8] Univ Da Nang, Adv Inst Sci & Technol, Da Nang 550000, Vietnam
关键词
thermal conductivity; mechanical flexibility; graphene fluoride; aramid nanofibers; metallicionic bonding; vacuum filtration; NANOCOMPOSITES;
D O I
10.1021/acsanm.3c04771
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Flexible electronics require thermally conductive materials with excellent mechanical flexibility to dissipate heat and ensure optimal performance. This work reports the development of metallic ionic cross-linked thermally conductive and mechanically flexible films composed of aramid nanofibers (ANFs) and exfoliated graphene fluoride (EGF) nanosheets. EGF was prepared by liquid exfoliation of fluorinated graphite and incorporated into ANF films fabricated by vacuum filtration. Metallic ion (Al3+) treatment was used to improve interfacial interactions between the EGF fillers and ANF matrix. The EGF-reinforced ANF composite films displayed excellent in-plane thermal conductivity up to 19.48 W/mK for the sample with 50 wt % EGF, owing to the high intrinsic thermal conductivity of EGFs and their preferential alignment along the in-plane direction. The composite films also exhibited outstanding mechanical flexibility and durability, with tensile strength >150 MPa even at 50 wt % EGF content, enabled by efficient stress transfer across the EGF-ANF interface. Thermal conductivity was thermally stable up to 200 degrees C. The unique combination of high in-plane thermal conductivity, mechanical flexibility, and thermal stability illustrates the potential of ANF/EGF films for effective thermal management in flexible electronics.
引用
收藏
页码:2724 / 2734
页数:11
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